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首页> 外文期刊>Mathematics and mechanics of solids: MMS >The thermoelastic contact problem for wavy surfaces with a heat-conducting medium in interface gaps
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The thermoelastic contact problem for wavy surfaces with a heat-conducting medium in interface gaps

机译:波纹表面的热弹性接触问题,具有界面间隙中的热导热介质

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摘要

This paper presents a study on the thermoelastic contact between a wavy surface and a flat surface in the presence of a heat-conducting interstitial medium in interface gaps. The influence of applied mechanical and thermal loads on the deformation of the gaps is taken into account. The contact problem is reduced to a system of singular integro-differential equations for a temperature jump across the gaps and the height of the gaps. Solutions are obtained for the cases of thermoinsulated and heat-conducting gaps. It is shown that, in contrast to the thermoinsulated gap model, the use of the heat-conducting gap model makes it possible to construct a physically correct solution of the contact problem. It is revealed that the wavy interface with heat-conducting gaps exhibits thermal rectification. The effects of the medium's thermal conductivity, the pressure and heat flow magnitudes and the waviness amplitude on the effective thermal contact resistance and the level of thermal rectification are analysed.
机译:本文介绍了在界面间隙中的热传导间隙介质存在的波状表面和平坦表面之间的热弹性接触的研究。考虑了应用机械和热负荷对间隙变形的影响。接触问题减少到奇异积分微分方程的系统,用于跨越间隙的温度跳跃和间隙的高度。获得溶液的热污染和热传导间隙的情况。结果表明,与热弹性间隙模型相比,使用导热隙模型使得可以构建物理上正确的接触问题解决方案。揭示了具有导热差距的波浪接口表现出热整流。分析了介质的导热系数,压力和热流幅度和有效热接触电阻上的波纹幅度的影响和热整流水平。

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