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首页> 外文期刊>Functional Plant Biology >Effects of Ni2+ and Cu2+ on K+ and H+ currents in lily pollen protoplasts
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Effects of Ni2+ and Cu2+ on K+ and H+ currents in lily pollen protoplasts

机译:Ni2 +和Cu2 +对百合花粉原生质体中K +和H +电流的影响

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摘要

Heavy metals affect plant development and reproduction if they are present in excessive amounts, a situation that is becoming increasingly common. Pollen is a convenient object for pollution assessment as it is in most cases a 2- or 3-cellular organism exposed to the environment. At the same time, pollen is a key stage in the life cycle of seed plants; pollen viability and efficiency of germination are crucial for reproductive success and crop yield. In the present study we reveal for the first time, to our knowledge, targets for heavy metals (Cu2+ and Ni2+) in the pollen grain plasma membrane using the patch-clamp technique. Ni2+ dramatically decreases K+ current in pollen grain protoplasts, whereas Cu2+ does not alter the current density. Instead, Cu2+ strongly enhances H+ current driven by H+-ATPase, whereas Ni2+ fails to affect this current. The short-term treatment with Cu2+ also leads to reactive oxygen species (ROS) accumulation in pollen grain protoplasts but intracellular pH and membrane potential remain unchanged. Ni2+ had no significant effect on ROS content or membrane potential. Thus, plasmalemma K+ channels in pollen grains are sensitive to Ni2+ and H+-ATPase is sensitive to Cu2+, possibly, in a ROS-mediated way. Both metals leave pollen viable since membrane potential is maintained at the control level.
机译:如果它们以过度的数量存在,重金属会影响植物开发和繁殖,这一情况变得越来越普遍。花粉是污染评估的方便物体,因为它在大多数情况下,暴露于环境的2个或3个细胞生物体。同时,花粉是种子植物生命周期的关键阶段;花粉活力和发芽效率对于生殖成功和作物产量至关重要。在本研究中,我们首次揭示了我们的知识,使用贴片技术的花粉晶粒质膜中的重金属(Cu2 +和Ni2 +)的靶向。 Ni2 +显着降低花粉晶粒基质的K +电流,而Cu2 +不会改变电流密度。相反,Cu2 +强大地增强了由H + -ATPase驱动的H +电流,而Ni2 +不能影响该电流。用Cu2 +的短期治疗也导致花粉晶粒类化合物中的活性氧物质(ROS)积累,但细胞内pH和膜电位保持不变。 NI2 +对ROS含量或膜电位没有显着影响。因此,花粉晶粒中的离子血压K +通道对Ni2 +和H + -ATPase敏感于Cu2 +,可能以ROS介导的方式敏感。由于膜电位保持在控制水平,金属留出花粉可行性。

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