A rapid seismic data calibration technique using integrated micro-electro-mechanical system inertial sensor groups for a 3C vertical seismic profile

摘要

Calibration of 3C vertical seismic profile (VSP) data is an exciting challenge because the orientation of the tool is random when only seismic data are considered. We have augmented the sensor package on the VSP tool with microelectro-mechanical system (MEMS) inertial sensors and applied a gesture measuring method to determine the tool orientation and calibration. This technique can quickly produce high precision, orientation, and angle information when integrated with the seismometer. The augmented sensor package consists of a low-cost triaxial MEMS gyroscope, an electronic compass, and an accelerometer. The technique to process the gesture information is based on the OpenGL software for 3D modeling. We have tested this approach on a large number of field data sets and it appeared to be faster and more reliable than other approaches.