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Modified Dual Piezo Configuration for Improved Structural Health Monitoring Using Electro-Mechanical Impedance (EMI) Technique

机译:改进的双压电配置,用于采用机电阻抗(EMI)技术改进的结构健康监测

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This paper presents a new variant of the electro-mechanical impedance (EMI) technique encompassing sensor-actuator dual configuration for improved damage assessment. In this arrangement, called as dual piezo configuration (DPC), an outer piezoelectric ring acts as the actuator and an inner piezoelectric disc as the sensor. The configuration yields better results than the conventional EMI configuration employing the same piezo patch as the sensor as well as the actuator. This paper presents a more practical and modified version of DPC entailing a group of normal commercially available PZT patches. The piezo sensor configurations evaluated in the paper are: (a) single piezo configuration (SPC), which is conventionally employed in the EMI technique; (b) dual piezo configuration (DPC), which consists two different patches in ring type configuration; and (c) modified dual piezo configuration (MDPC), which uses four outer piezo patches for the actuation and a centrally located piezo patch for the sensing purpose. The paper first covers the comparison of the three configurations through finite element method (FEM), using an aluminum block of dimensions 48x48x10mm as the host structure and lead zirconate titanate (PZT) patches of size 10x10x0.3mm, analyzed through coupled field analysis. The simulation study is followed by an experiment on the aluminum block of the same size and finally on a prototype steel plate of dimensions 1200x970x8mm. Simulation results and experimental data prove that the proposed MDPC is much more sensitive to the occurrence than the conventional SPC. Also, MDPC ensures much larger zone of influence as compared to the conventional SPC as well as the DPC and it commands higher sensitivity. Hence, it can be employed on the large structures to detect damage, which is not possible by using the SPC which may warrant very large number of sensors. Thus, the proposed MDPC approach can be practically employed to detect the damage in large civil, mechanical a
机译:本文介绍了包括传感器致动器双配置的机电阻抗(EMI)技术的新变种,以改善损伤评估。在这种布置中,称为双压电配置(DPC),外部压电环用作致动器和作为传感器的内压电盘。该配置比采用与传感器以及致动器的相同压电贴片的传统EMI配置产生更好的结果。本文提出了一种更实用和改进的DPC版本,其旨在一组正常的商业上可获得的PZT斑块。本文评估的压电传感器配置是:(a)单个压电配置(SPC),其传统上用于EMI技术; (b)双压电配置(DPC),其中包含两个不同的胶片类型配置; (c)改进的双压电配置(MDPC),它使用四个外部压电贴片,用于致动和集中的压电贴片,用于传感目的。本文首先通过有限元方法(FEM)来介绍三种配置的比较,使用铝块48x48x10mm作为宿主结构和铅锆钛(PZT)尺寸10x10x0.3mm的锆蛋白斑块,通过耦合场分析分析。仿真研究之后是在相同尺寸的铝块上进行实验,最后在1200x970x8mm的原型钢板上。仿真结果和实验数据证明,所提出的MDPC对事件比传统SPC更敏感。此外,与传统的SPC以及DPC相比,MDPC确保了更大的影响区域,并且它命令更高的灵敏度。因此,可以在大结构上采用以检测损坏,这是通过使用SPC无法保证大量传感器的损坏。因此,所提出的MDPC方法实际上可以用于检测大型民事,机械A中的损坏

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