Slashing Printed Circuit Board Design Cycle Time Using Real-Time PCB Thermal Analysis Tools

摘要

Electronic devices are getting smaller, yet they are more powerful. More and more electronic components are being packed onto PCBs, which generate more heat and makes heat management critical. Overheating will not only affect the chips and processors on the PCB, but also adjacent components and the overall system. Sealed electronic devices have also become more prevalent, which reduces the impact of forced convection cooling. Today, thermal management of electronic devices depends primarily on the ability of the PCB to dissipate heat. This means that the goal is to properly arrange the electronic components and create efficient conduction paths that move heat from the heat sources to lower temperature thermal sinks.