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Wet-chemical treatment and electronic interface properties of silicon solar cell substrates

机译:硅太阳能电池基板的湿化学处理和电子界面特性

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摘要

On textured n-type silicon substrates for solar cell manufacturing, the relation between light trapping behav_ior, structural imperfections, energetic distribution of interface state densities and interface recombination losses were investigated by applying surface sensitive techniques. The field-modulated surface photovolt_age (SPV), in-situ photoluminescence (PL) measurements, total hemispherical UV-NIR-reflectance mea_surements and electron microscopy (SEM) were employed to yield detailed information on the influence of wet-chemical treatments on preparation induced micro-roughness and electronic properties of polished and textured silicon substrates. It was shown that isotropic as well as anisotropic etching of light trap_ping structures result in high surface micro-roughness and density of interface states. Removing damaged surface layers in the nm range by wet-chemical treatments, the density of these states and the related inter_face recombination loss can be reduced. In-situ PL measurements were applied to optimise HF-treatment times aimed at undamaged, oxide-free and hydrogen-terminated substrate surfaces as starting material for subsequent solar cell preparations.
机译:在用于太阳能电池制造的纹理化n型硅衬底上,通过应用表面敏感技术研究了光捕获行为,结构缺陷,界面态密度的高能分布和界面复合损失之间的关系。利用场调制表面光伏电压(SPV),原位光致发光(PL)测量,总半球UV-NIR反射率测量和电子显微镜(SEM)得出了有关湿化学处理对制剂诱导影响的详细信息抛光和纹理化的硅基板的微观粗糙度和电子性能。结果表明,对光阱结构的各向同性和各向异性蚀刻会导致较高的表面微观粗糙度和界面态密度。通过湿化学处理去除nm范围内的受损表面层,可以降低这些状态的密度和相关的界面重组损失。应用原位PL测量来优化HF处理时间,以针对未损坏,无氧化物和氢封端的基材表面作为后续太阳能电池制备的起始材料。

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