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首页> 外文期刊>Engineering Review >FRICTION STIR WELDING OF NEW ELECTRONIC PACKAGING MATERIALS SiCp/Al COMPOSITE WITH T-JOINT
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FRICTION STIR WELDING OF NEW ELECTRONIC PACKAGING MATERIALS SiCp/Al COMPOSITE WITH T-JOINT

机译:新型电子包装材料SICP / Al复合材料用T关节摩擦搅拌焊接

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摘要

Usingfriction stir welding, the electronic container box and lid made from aluminium matrix composites with reinforcement of SiC particle (15 vol% SiCp/Al-MMCs) was welded successfully with T-joint. The temperature distribution of box during the process, mechanical property and microstructure of the joint as well as gas tightness of welded box was investigated. The experimental results indicated that the satisfactory T-joint can be obtained under appropriate friction stir welding parameters. During the welding process, the bottom center, which was used to place the electronic component, reached a quite lower temperature of 100癈. That can ensure safety of components in the box. After the welding process, the microstructure in stir zone was better than in base material due to the refining and homogeneous distribution of the SiC particles. The experimental results showed that the electronic container box after friction stir welding had gas tightness. The He-leakage rate was under 10~(-8) Pa-m~3/s.
机译:使用过摩擦焊接,电子容器盒和由铝基复合材料制成的具有加强SiC粒子(15 Vol%SICP / Al-MMC)的铝基复合材料,用T关节成功焊接。研究了箱内箱的温度分布,接头的机械性能和微观结构以及焊接箱的气密性。实验结果表明,在适当的摩擦搅拌焊接参数下可以获得令人满意的T关节。在焊接过程中,用于放置电子元件的底部中心达到了100‰的相当较低的温度。这可以确保盒子中的组件安全。在焊接过程之后,由于SiC颗粒的精炼和均匀分布,搅拌区的微观结构优于基础材料。实验结果表明,摩擦搅拌焊接后的电子容器箱具有气密性。他泄漏率低于10〜( - 8)PA-M〜3 / s。

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