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A novel triple-band microwave chip-less sensor tag for structural health monitoring applications

机译:用于结构健康监测应用的新型三频微波芯片传感器标签

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摘要

In this paper, a novel triple-band microwave chip-less sensor tag is presented for Structural Health Monitoring (SHM) systems. Remote sensing capability of microwave devices is employed here to design a sensor for crack detection in metallic structures. The cracks occurred by natural fatigue or human-made mistakes can be distinguished by desired sensor tags. Triple-band operation of the proposed sensor tag at C and X frequency bands is considered here to precisely detect the narrow-width cracks and their directions. In RCS calculations, the resonant frequencies of the designed sensor tag are displaced at the presence of cracks on its ground plane. The proposed sensor tag can detect cracks with a resolution of 0.2 mm which shows a RCS resonant frequency shift of at least 21.1 MHz. This is a big improvement of detectable range in SHM applications compared to the current sensors.
机译:本文提出了一种新型三带微波芯片的传感器标签,用于结构健康监测(SHM)系统。 这里采用微波器件的遥感能力来设计用于金属结构裂纹检测的传感器。 可以通过期望的传感器标签来区分天然疲劳或人造错误发生的裂缝。 在此考虑C和X频带的所提出的传感器标签的三带操作,以精确地检测窄宽裂缝及其方向。 在RCS计算中,设计的传感器标签的谐振频率在其接地平面上的裂缝存在下移位。 所提出的传感器标签可以检测分辨率为0.2mm的裂缝,其表示至少21.1MHz的RCS谐振频率偏移。 与电流传感器相比,这是SHM应用中可检测范围的大大改进。

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