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COMBINATIONAL LOGIC ANALYSIS WITH LASER VOLTAGE PROBING

机译:使用激光电压探测组合逻辑分析

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摘要

As technologies scale, integrated circuits (ICs) now have incredibly dense transistor packing that can fail due to miniscule defects, which require electrical fault isolation (EFI). Of several available EFI techniques, laser voltage probing (LVP) and derivatives (such as LVx) using continuous-wave near-infrared laser are very popular. The operating principle of LVx is that the absorption of light gets modulated by changes in the electrical field and the free carrier (plasma) density within a transistor as it switches. The fault isolation precision of these tools ultimately depends on the resolution of the optical probe.
机译:作为技术规模,集成电路(ICS)现在具有令人难以置信的致密晶体管填料,其由于小型缺陷而导致的,这需要电气故障隔离(EFI)。 其中几种可用的EFI技术,使用连续波近红外激光器的激光电压探测(LVP)和衍生物(如LVX)非常流行。 LVX的操作原理是,在其开关时,通过电场和晶体管内的自由载体(等离子体)密度的变化来调制光的吸收。 这些工具的故障隔离精度最终取决于光学探针的分辨率。

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