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首页> 外文期刊>International Journal of Solids and Structures >Spherical nano-inhomogeneity with the Steigmann-Ogden interface model under general uniform far-?eld stress loading
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Spherical nano-inhomogeneity with the Steigmann-Ogden interface model under general uniform far-?eld stress loading

机译:具有普通均匀均匀均匀的Steigmann-ogden接口模型的球形纳米型纳米型纳米型纳米型

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摘要

An explicit solution, considering the interface bending resistance as described by the Steigmann-Ogden interface model, is derived for the problem of a spherical nano-inhomogeneity (nanoscale void/inclusion) embedded in an in?nite linear-elastic matrix under a general uniform far-?eld-stress (including ten-sile and shear stresses). The Papkovich-Neuber (P-N) general solutions, which are expressed in terms of spherical harmonics, are used to derive the analytical solution. A superposition technique is used to overcome the mathematical complexity brought on by the assumed interfacial residual stress in the Steigmann-Ogden interface model. Numerical examples show that the stress ?eld, considering the inter-face bending resistance as with the Steigmann-Ogden interface model, differs signi?cantly from that con-sidering only the interface stretching resistance as with the Gurtin-Murdoch interface model. In addition to the size-dependency, another interesting phenomenon is observed: some stress components are in-variant to interface bending stiffness parameters along a certain circle in the inclusion/matrix. Moreover, a characteristic line for the interface bending stiffness parameters is presented, near which the stress concentration becomes quite severe. Finally, the derived analytical solution with the Steigmann-Ogden interface model is provided in the supplemental MATLAB code, which can be easily executed, and used as a benchmark for semi-analytical solutions and numerical solutions in future studies.
机译:考虑如Steigmann-ogden接口模型所描述的界面弯曲电阻的显式解决方案是推导出在一般均制服下嵌入嵌入的球形纳米不均匀性(纳米级空隙/夹杂物)的问题远 - 胁迫(包括十分架和剪切应力)。 Papkovich-Neuber(P-N)在球形谐波中表达的一般解决方案用于导出分析解决方案。通过Steigmann-ogden接口模型中假设的界面残余应力来克服所带来的数学复杂性的叠加技术。数值示例表明,应力?ELD,考虑到与Steigmann-ogden界面模型的面部间弯曲电阻不同,因此只能从该CONIVESIVES中延伸,只有与Gurtin-Murdoch接口模型的界面拉伸电阻。除了尺寸依赖性之外,观察到另一个有趣的现象:一些应力分量是沿包含/矩阵中的特定圆圈的互补刚度参数。此外,提出了界面弯曲刚度参数的特征线,附近应力浓度变得非常严重。最后,在补充MATLAB代码中提供了具有Steigmann-ogden接口模型的导出的分析解,可以很容易地执行,并用作未来研究中半分析解决方案和数值解决方案的基准。

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