首页> 外文期刊>International Journal of Adhesion & Adhesives >Finite element inversion method for interfacial stress analysis of composite single-lap adhesively bonded joint based on full-field deformation
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Finite element inversion method for interfacial stress analysis of composite single-lap adhesively bonded joint based on full-field deformation

机译:基于全场变形的复合单圈粘接接头界面应力分析的有限元转化方法

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摘要

A hybrid inversion method combining the finite element method and full-field displacement data was proposed to analyze the adhesive interface stress at a composite single-lap bonded joint. The displacement field distribution for the outer surface of the overlapped composite plate was measured through the two-dimensional digital image correlation method at different times by performing a tensile test. At the same time, the finite element analysis of the single-lap joint was carried out, which provided the data on structural deformation characteristics. Then, a polynomial interpolation method was used to establish the relation between the internal and external surface displacements. The displacements of the inner surface of the plate can be calculated from the measured displacement data of the outer surface of the plate by using the polynomial function. The displacements of the inner surface of the plate are regarded as the displacement load conditions for the outer and inner surfaces of the plate to establish the finite element model of the adhesive layer. The validity of the hybrid inversion method was proved by FEM analysis and experiments.
机译:组合有限元方法和全场位移数据的混合反演方法是提出分析复合单圈键合接头处的粘合界面应力。通过执行拉伸试验,通过不同时间通过二维数字图像相关方法测量重叠复合板的外表面的位移场分布。同时,进行单圈接头的有限元分析,提供了关于结构变形特性的数据。然后,使用多项式插值方法来建立内部和外表面位移之间的关系。通过使用多项式函数,可以根据板的外表面的测量位移数据计算板的内表面的位移。板的内表面的位移被认为是板的外表面和内表面的位移载荷条件,以建立粘合剂层的有限元模型。通过有限元分析和实验证明了混合反演方法的有效性。

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