Effect of Processing Temperature and Holding Time on Al/Sic Composites: An Experimental Study

摘要

The bonding at the interface between metal-ceramic is very important phenomena in the metal matrix composites. The properties of composite are mainly depends on the behavior of interface. Therefore, it is essential to understand the nature of interface bonding between metal and ceramic. The bonded samples of aluminium and silicon carbide were prepared at different processing temperatures with different holding time. The formation of intermetallic compounds at the interface was evaluated by energy dispersive spectroscopy and scanning electron microscopy. The interface strength was evaluated by tensile and microhardness test.