The Mechanism of Sulphide Film Growth on Copper in Anaerobic Sulphide Solutions Under Natural Corrosion Conditions

摘要

Background and Method: The growth mechanism of sulphide films formed on copper in anaerobic 0.1 M NaCl + 5 × 10~(-4) M Na2S solution has been investigated under natural corrosion conditions for exposure periods up to 1691 hours using scanning electron microscopy, focused ion beam cross-sectioning, and a Au marker procedure. Results and Conclusion: The film formed by a chemical deposition process via an outward growth mechanism. This process was controlled by cuprous ion transport in the film combined with sulphide diffusion in solution.