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Influence of anisotropic thermal conductivity in the apparatus insulation for sublimation growth of SiC: Numerical investigation of heat transfer

机译:各向异性热导率在设备绝缘中对SiC升华生长的影响:传热的数值研究

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摘要

Using a mathematical heat transfer model including anisotropic heat conduction, radiation, and radio frequency (RF) heating, we perform numerical computations of the temperature field in an axisymmetric growth apparatus during sublimation growth of silicon carbide (SiC) bulk single crystals by physical vapor transport (PVT) ( modified Lely method). Because it is not unusual for the thermal insulation of a PVT growth apparatus to possess an anisotropic thermal conductivity, we numerically study the influence that this anisotropic thermal conductivity has on the temperature field in the growth chamber. Moreover, we also study the influence of the thickness of the insulation. Our results show that, depending on the insulation's orientation, even a moderate anisotropy in the insulation can result in temperature variations of more than 100 K at the growing crystal's surface, which should be taken into account for the simulation as well as for the design of a PVT growth apparatus.
机译:使用包括各向异性导热,辐射和射频(RF)加热的数学传热模型,我们在通过物理气相传输升华生长碳化硅(SiC)块状单晶期间,对轴对称生长设备中的温度场进行了数值计算。 (PVT)(改良的Lely方法)。由于PVT生长设备的绝热材料具有各向异性的热导率并不少见,因此我们通过数值研究了这种各向异性的热导率对生长室中温度场的影响。此外,我们还研究了绝缘层厚度的影响。我们的结果表明,根据绝缘材料的方向,即使绝缘材料中的各向异性程度较低,也可能导致生长晶体表面的温度变化超过100 K,在进行仿真和设计时应考虑到这一点。 PVT生长设备。

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