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UV-Curable Epoxies for Dam and Fill Applications

机译:耐紫外线固化的水坝和填充应用的环氧树脂

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摘要

Dam and fill is a selective process that protects specific areas of a PCB with an optically transparent encapsulant using two different materials.Encapsulants of this kind usually have a low viscosity.A dam is therefore applied around the component first to prevent the potting material from flowing across the substrate.Epo-Tek OG116-31,a product manufactured by Kummer,is a UV-curable epoxy.Because of its thixotropic nature it is often used as a dam material.It can be cured with UV light in a very short time.The encapsulant,which is either a UV-curable or a thermoset material,is applied afterwards.
机译:坝和填充是一种选择性过程,用两个不同的材料用光学透明的密封剂保护PCB的特定区域。这种方法通常具有低粘度。因此,首先施加坝以防止灌封材料流动 跨越底座.PO-TEK OG116-31,Kummer制造的产品是一种紫外线固化的环氧树脂。因为其触变性性质,它通常用作坝体材料。可以在很短的时间内用UV光固化 。之后施加紫外线固化物或热固性材料的密封剂。

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