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Stability of fault current limiter with conduction cooled Bi2223 screen

机译:带传导冷却Bi2223屏蔽的故障限流器的稳定性

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We examined a stability of magnetic shield type fault current limiter (MSFCL) with Bi2223 screen cooled by cryocooler thermally. Conduction cooled MSFCL handles better and needs easier maintenance than that cooled by liquid cryogen. In addition, the cost of the MSFCL decreases by the decrease of the required volume of the superconductor with the increase of the critical current density. We made the small model of the MSFCL with Bi2223 ring, ac loss of one ring under a normal operating condition was measured at 30 K determined by the critical current density of Bi2223 short sample. The measured ac loss almost corresponded to the hysteresis loss calculated from Beam model. The ac loss of the MSFCL with the shielding body of the stacked Bi2223 rings for 6.6 kV-1 kA distribution power system was calculated from Bean model. From the relation between the required number of the rings and the critical current density, the design outlines of the shielding body of conduction cooled MSFCL was obtained. The MQE of one Bi2223 ring of the small model was measured, and we confirmed that the MSFCL using high T_c superconductor had high stability against a local heat disturbance even at 30 K. In the case of the MSFCL with the stacked rings for a distribution power system, the improvement of the stability due to the current sharing between rings was confirmed by the numerical calculation.
机译:我们检查了Bi2223屏幕由低温冷却器热冷却的磁屏蔽型故障电流限制器(MSFCL)的稳定性。传导冷却的MSFCL比液态制冷剂具有更好的操作性,并且需要更轻松的维护。此外,随着临界电流密度的增加,超导体所需体积的减少也降低了MSFCL的成本。我们制作了带有Bi2223环的MSFCL的小模型,在正常工作条件下,通过Bi2223短样品的临界电流密度确定了在正常工作条件下一个环的交流损耗。测得的交流损耗几乎对应于根据Beam模型计算的磁滞损耗。根据Bean模型,计算了6.6 kV-1 kA配电系统中带有堆叠式Bi2223环的屏蔽体的MSFCL的交流损耗。根据所需的环数和临界电流密度之间的关系,得出了传导冷却的MSFCL屏蔽体的设计轮廓。测量了一个小模型的Bi2223环的MQE,我们确认使用高T_c超导体的MSFCL即使在30 K时也具有较高的抵抗局部热扰动的稳定性。对于带有堆叠环的MSFCL,分配功率该系统通过数值计算证实了由于环之间共享电流而提高了稳定性。

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