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首页> 外文期刊>ACM Transactions on Embedded Computing Systems >Hardware-Software Collaborative Thermal Sensing in Optical Network-on-Chip-based Manycore Systems
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Hardware-Software Collaborative Thermal Sensing in Optical Network-on-Chip-based Manycore Systems

机译:基于光网络的多芯系统中的硬件软件协作热敏

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摘要

Continuous technology scaling in manycore systems leads to severe overheating issues. To guarantee system reliability, it is critical to accurately yet efficiently monitor runtime temperature distribution for effective chip thermal management. As an emerging communication architecture for new-generation manycore systems, optical network-on-chip (ONoC) satisfies the communication bandwidth and latency requirements with low power dissipation. Moreover, observation shows that it can be leveraged for runtime thermal sensing. In this article, we propose a brand-new on-chip thermal sensing approach for ONoC-based manycore systems by utilizing the intrinsic thermal sensitivity of optical devices and the inter-processor communications in ONoCs. It requires no extra hardware but utilizes existing optical devices in ONoCs and combines them with lightweight software computation in a hardware-software collaborative manner. The effectiveness of the our approach is validated both at the device level and the system level through professional photonic simulations. Evaluation results based on synthetic communication traces and realistic benchmarks showthat our approach achieves an average temperature inaccuracy of only 0.6648 K compared to ground-truth values and is scalable to be applied for large-size ONoCs.
机译:在多核系统中连续技术缩放导致严重过热问题。为了保证系统可靠性,重要的是准确且有效地监控运行时温度分布,以实现有效芯片热管理。作为新一代Manycore系统的新兴通信架构,光学网络(ONC)满足了低功耗的通信带宽和延迟要求。此外,观察结果表明它可以利用运行时热敏。在本文中,我们通过利用光学器件的内在热敏性和在ONOC中的处理器间通信的内在热敏性提出了一种全新的芯片热传感方法。它不需要额外的硬件,但使用ONOC中的现有光学设备,并以硬质软件计算以硬件软件协作方式结合它们。通过专业光子模拟,在设备级和系统级别验证了我们方法的有效性。基于合成通信迹线的评估结果和现实基准显示我们的方法与地面真值值相比,我们的方法仅实现了0.6648克的平均温度不准确,并且可用于适用于大型枪口的可扩展性。

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