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首页> 外文期刊>Cryogenics >Analysis of current and voltage distribution in the first Japanese qualification sample of an ITER TF conductor
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Analysis of current and voltage distribution in the first Japanese qualification sample of an ITER TF conductor

机译:ITER TF导体的第一个日本合格样品中的电流和电压分布分析

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摘要

The critical currents of the Japanese ITER TF conductors made through an internal-tin and bronze process were preliminarily estimated to be about 5.7 K, which approximates the design value of 5.7 K, and about 6.1 K, respectively, at 68 kA and 11.8 T using a short conductor sample. To investigate the influence of the current distribution in the sample conductor, a simulation was performed using a lumped circuit model of a cable and static electrical field model for jackets. The simulation results show that a large, non-uni-form current distribution is established due to magneto-resistance of the copper in the joint and an imbalance of contact resistance of the strands to the copper and by poor soldering between the copper shoes, results which make a precise evaluation of the critical current performance difficult. The analytical results indicate that the current sharing temperature of the internal-tin and bronze process conductors is expected to be 6.0 K and 6.7 K, respectively, when the current distribution is uniform. In addition, solder filling of the joints makes the current distribution uniform due to the normal resistance in the high field zone, and the current sharing temperature can be estimated as almost the same as when the current dis-tribution is uniform. The other possible solution is to use a thin copper plate with a low RRR to reduce the influence of magneto-resistance and any non-uniformity in contact resistance. Conductor performance is under-estimated in this case because the non-uniform current distribution still remains. However, the reduction in the estimated current sharing temperature is expected to be a few hundred milli-Kelvins, which seems acceptable as a margin in a qualification trial.
机译:初步估计,通过内部锡和青铜工艺制成的日本ITER TF导体的临界电流约为5.7 K,分别接近于68 kA和11.8 T时的设计值5.7 K和6.1K。短导体样品。为了研究样品导体中电流分布的影响,使用电缆的集总电路模型和护套的静电场模型进行了仿真。仿真结果表明,由于接头中铜的磁阻,线束与铜的接触电阻不平衡以及铜靴之间的焊接不良,导致建立了较大的不均匀电流分布。这使得难以精确评估关键电流性能。分析结果表明,当电流分布均匀时,内部锡工艺导体和青铜工艺导体的均流温度预计分别为6.0 K和6.7K。另外,由于在高场区中的法向电阻,接头的焊料填充使电流分布均匀,并且可以将电流共享温度估计为与电流分布均匀时几乎相同。另一种可能的解决方案是使用具有低RRR的薄铜板来减少磁阻的影响以及接触电阻的任何不均匀性。在这种情况下,导体性能会被低估,因为仍然存在不均匀的电流分布。但是,预计的电流共享温度的降低预计将达到几百开氏度,这在鉴定试验中似乎可以接受。

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