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Mixed-mode fracture toughness testing of a Cu/Ag bimetallic interface via atomistic simulations

机译:通过原子模拟Cu / Ag双金属界面的混合模式断裂韧性测试

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This work presents the evaluation of mixed-mode fracture toughness for an interface crack using molecular dynamics simulations. A Cu/Ag bimetallic structure with an interface crack was configured, where the atomic interactions were characterized based on the embedded-atom method potential. A bimaterial K-field of linear elastic fracture mechanics was employed as a remote loading for the mixed-mode failure. The traction ratio of the shear to normal component in front of a crack tip was defined as the mode mixity. The critical value of the J-integral for the onset of crack growth along the interface was measured as the interfacial fracture toughness; the value was also compared to the critical energy release rate and the Griffith fracture toughness. The interfacial fracture toughness of a Cu/Ag bimaterial was found to exhibit significant dependence on mode mixity for an interface crack, which resulted from various types of atomic-scale deformation at the interface.
机译:该工作介绍了使用分子动力学模拟的界面裂纹的混合模式断裂韧性的评价。 配置具有界面裂缝的Cu / Ag双金属结构,其中基于嵌入式原子方法潜力表征了原子相互作用。 使用线性弹性断裂力学的双材料K字段作为混合模式故障的远程负载。 剪切到裂纹尖端前面的正常组分的牵引比定义为模式混合。 测量沿界面的裂纹生长开始的J-Integral的临界值作为界面裂缝韧性; 该值也与临界能量释放速率和GRIFFITH断裂韧性相比。 发现Cu / Ag双肢物的界面断裂韧性表现出对界面裂缝的模式混合的显着依赖性,这是由于界面处的各种原子尺度变形导致的界面裂缝。

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