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Integrated computational materials engineering for advanced materials: A brief review

机译:用于高级材料的集成计算材料工程:简要介绍

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摘要

After developing the simulation-based design approach of materials for decades, computational materials science/engineering present the power in accelerating the discoveries and the applications of novel advanced materials through a digital-twin design paradigm of integrated computational materials engineering (ICME). While the short goals of ICME are almost accomplished, those long goals are on the right way, highlighting the concept/strategy of materials by design. In this brief review, the recent frameworks of data-driven ICME in the last two years are discussed, presenting key aspects of principles, benchmarks, standards, databases, platforms and toolkits via various case studies. The author and his collaborators display a routine of data-driven ICME utilized in the investigations of Mg alloys through integrating the high-throughput first-principles calculations and the CALPHAD approach. It is highlighted that the bonding charge density could not only provide an atomic and electronic insight into the physical nature of chemical bond of pure elements, alloys, metal melts, oxides and semiconductors, surface and interfaces, but also reveal the fundamental solid-solution strengthening/embrittlement mechanism and the grain refinement mechanism, paving a path in accelerating the development of advanced materials. It is believed that the combinations of high-throughput multi-scale computations and fast experiments/manufacturing will build the advanced algorithms in the development of a promising digital fabricating approach to overcome the present and future challenges, illuminating the way toward the digital-twin intelligent manufacturing era.
机译:在发展基于材料的模拟的设计方法之后,计算材料科学/工程通过综合计算材料工程(ICME)的数字双床设计范式加速了新型先进材料的发现和应用。虽然ICME的短期目标几乎完成了,但那些长期的目标是正确的,突出了材料的概念/策略。在此简要介绍中,讨论了最近的数据驱动ICME框架,通过各种案例研究介绍了原则,基准,标准,数据库,平台和工具包的关键方面。作者及其合作者通过集成高通量的第一原理计算和鱿鱼方法,显示用于研究MG合金的数据驱动的ICME的例程。突出显示,粘接电荷密度不仅可以为纯元,合金,金属熔化,氧化物,氧化物和半导体,表面和界面的化学键的物理性质提供原子和电子洞察,而且还揭示了强大的固体溶液强化/脆化机制和晶粒细化机制,铺平了加快先进材料发展的路径。据信,高吞吐量多尺度计算和快速实验/制造的组合将在开发有前途的数字制造方法方面建立先进的算法,以克服现在和未来的挑战,照亮朝向数字双胞胎智能化的方式制造时代。

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