Citadel: Efficiently Protecting Stacked Memory from TSV and Large Granularity Failures

摘要

Stacked memory modules are likely to be tightly integrated with the processor. It is vital that these memory modules operate reliably, as memory failure can require the replacement of the entire socket. To make matters worse, stacked memory designs are susceptible to newer failure modes (e.g., due to faulty through-silicon vias, or TSVs) that can cause large portions of memory, such as a bank, to become faulty. To avoid data loss from large-granularity failures, the memory system may use symbol-based codes that stripe the data for a cache line across several banks (or channels). Unfortunately, such data-striping reduces memory-level parallelism, causing significant slowdown and higher power consumption.