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首页> 外文期刊>Acta Chemica Scandinavica >Inert copper ion complexes formed by humic acids
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Inert copper ion complexes formed by humic acids

机译:腐殖酸形成的惰性铜离子络合物

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摘要

In the pH range 7-2.6 copper ions form inert complexes with humic acids, which may be bound to intraparticle binding sites. This is shown by emf studies using glass and Cu-sensitive electrodes at 24 degrees C and 0.1 M NaClO4 medium. Solutions of Cu-II, (0.1-0.33 mM) and humic acids (1-2 g l(-1)) were titrated with HClO4 in an oxygen-free atmosphere. At each point the data were recorded after reaching a steady state (after 6-24 h) as indicated by a redox electrode. Kinetic data indicate that the metal ion interaction involves diffusion into the humic acid particles; the rate-limiting step appears to be the diffusion through the boundary layer surrounding the particles (film diffusion). For total Cu concentrations less than or equal to 0.24 mM, Cu ions seem to be bound in four-coordinate sites, since four protons are released per Cu ion. However, somewhat fewer protons are released (greater than or equal to 3) far the highest copper concentrations (0.33 mM) as well as for the lowest humic acid concentration (1 g l(-1)). In addition, a small fraction of the copper ions forms a labile CuA complex with log beta(1) = 5.3, most likely involving the coordination of two carboxylates. (Here A is the binding site of humic acids.) The proton reactions of humic acids, studied under the same conditions, are consistent with the titration of three acid-base groups of apparent pK-values, 5.8, 3.8, and 1.6, and a HA(2),'dimer' involving hydrogen bonds of the particles. [References: 46]
机译:在pH范围7-2.6中,铜离子与腐殖酸形成惰性络合物,可能与颗粒内结合位点结合。使用玻璃和铜敏感电极在24摄氏度和0.1 M NaClO4介质下进行的电动势研究表明了这一点。在无氧气氛中,用HClO4滴定Cu-II(0.1-0.33 mM)和腐殖酸(1-2 g l(-1))的溶液。如氧化还原电极所示,在达到稳定状态(6-24小时后)后,在每个点记录数据。动力学数据表明,金属离子相互作用涉及向腐殖酸颗粒中的扩散。限速步骤似乎是通过颗粒周围边界层的扩散(膜扩散)。对于总Cu浓度小于或等于0.24 mM的情况,由于每个Cu离子释放四个质子,因此Cu离子似乎被束缚在四个坐标位置。然而,远低于最高铜浓度(0.33 mM)和最低腐殖酸浓度(1 g l(-1))的质子释放量少(大于或等于3)。此外,一小部分铜离子形成不稳定的CuA络合物,log beta(1)= 5.3,最有可能涉及两个羧酸盐的配位。 (此处A是腐殖酸的结合位点。)在相同条件下研究的腐殖酸的质子反应与三个表观pK值5.8、3.8和1.6的酸碱基团的滴定一致,并且HA(2),“二聚体”,涉及颗粒的氢键。 [参考:46]

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