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Improvement of performance of a Au-Cu/AC catalyst using thiol for acetylene hydrochlorination reaction

机译:使用硫醇进行乙炔氢氯化反应的Au-Cu / Ac催化剂的性能改善

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摘要

In order to overcome problems of Au-Cu bimetallic catalysts for acetylene hydrochlorination reaction such as instability, Au-Cu-SH/AC catalysts were prepared through the introduction of thiol and tested to examine their activity and stability. It was found that performances of Au-Cu-SH/AC catalysts were quite excellent, with significantly higher catalytic activity and better stability than performances of Au/AC and Au-Cu/AC catalysts. The contents of Cu and thiol additives were also optimized and the optimum molar ratio of Au/Cu/SH was 1 : 1 : 10. Catalyst samples were characterized by scanning electron microscopy (SEM), nitrogen adsorption/desorption (BET), X-ray diffraction (XRD), transmission electronic microscopy (TEM), H-2 temperature-programmed reduction (H-2-TPR), and X-ray photoelectron spectroscopy (XPS). It was demonstrated that the Au-Cu-SH/AC catalysts were Au-0-based catalysts, due to thiol reducing Au3+ to Au-0 species during the preparation process. Au-0 species exhibited better catalytic activity than Au3+ species for acetylene hydrochlorination, according to the comparison with the composition of active species in different samples through XPS. Furthermore, the sulfhydryl of thiol could bond to the surface of gold nanoparticles (Au NPs). It helped in mitigating the oxidation of Au-0 by HCl, protecting Au NPs from structure damage, stabilizing Au NPs in a nearly constant particle size and keeping a more active structure in the reaction environment. Thus, improved dispersity of active species and protection of the active structure of the Au NPs resulted in the better catalytic activity and stability of Au-Cu-SH/AC.
机译:为了克服Au-Cu二金属催化剂的问题,用于乙炔氢氧化反应,例如不稳定性,通过引入硫醇并测试以检查其活性和稳定性的Au-Cu-Sh / Ac催化剂。发现Au-Cu-Sh / Ac催化剂的性能非常优异,催化活性明显高,稳定性比Au / Ac和Au-Cu / Ac催化剂的性能更高。还优化了Cu和硫醇添加剂的含量,Au / Cu / Sh的最佳摩尔比为1:1:10:催化剂样品通过扫描电子显微镜(SEM),氮吸附/解吸(BET),X-射线衍射(XRD),透射电子显微镜(TEM),H-2温度编程(H-2-TPR)和X射线光电子谱(XPS)。结果证明,Au-Cu-Sh / AC催化剂是Au-0类催化剂,由于在制备过程中,由于硫醇还原Au3 +至Au-0种。根据与XPS中不同样品中的不同样品中的活性物种组成的比较,AU-0种表现出比Au3 +乙炔氢氯化物的物种更好的催化活性。此外,硫醇的巯基可以粘合到金纳米粒子(Au nps)的表面上。它有助于通过HCl减轻Au-0的氧化,保护Au nps从结构损伤中保护Au nps,以几乎恒定的粒度稳定Au nps并保持更活跃的反应环境中的结构。因此,改善了活性物质的分散性和Au NPS的活性结构的保护导致Au-Cu-sh / Ac的催化活性和稳定性更好。

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  • 来源
    《RSC Advances》 |2016年第5期|共9页
  • 作者单位

    Zhejiang Univ Coll Chem &

    Biol Engn State Key Lab Chem Engn Hangzhou 310027 Zhejiang Peoples R China;

    Zhejiang Univ Coll Chem &

    Biol Engn State Key Lab Chem Engn Hangzhou 310027 Zhejiang Peoples R China;

    Zhejiang Univ Coll Chem &

    Biol Engn State Key Lab Chem Engn Hangzhou 310027 Zhejiang Peoples R China;

    Zhejiang Univ Coll Chem &

    Biol Engn State Key Lab Chem Engn Hangzhou 310027 Zhejiang Peoples R China;

    Zhejiang Univ Coll Chem &

    Biol Engn State Key Lab Chem Engn Hangzhou 310027 Zhejiang Peoples R China;

    Zhejiang Univ Coll Chem &

    Biol Engn State Key Lab Chem Engn Hangzhou 310027 Zhejiang Peoples R China;

    Univ Akron Dept Chem &

    Biomol Engn Akron OH 44325 USA;

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  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类 化学;
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