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首页> 外文期刊>Journal of thermal analysis and calorimetry >Analysis of thermo-physical properties of materials suitable for thermal stabilization of superconducting tapes for high-voltage superconducting fault current limiters
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Analysis of thermo-physical properties of materials suitable for thermal stabilization of superconducting tapes for high-voltage superconducting fault current limiters

机译:用于高压超导故障电流限制器的超导胶带热稳定的材料的热物理性质分析

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摘要

High-temperature superconducting coated conductors (CC) are attractive materials for high-voltage resistive fault current limiters. Commercially produced CC tapes cannot withstand electric fields over 100 V m(-1), and therefore, they have to be modified by addition of thermal stabilization layer. We investigated several composite systems suitable for such thermal stabilization. As a matrix of composites, Stycast resins were used, which contain various contents of powder particles from SiC, SiO2, PbTiO3, ZrW2O8, or synthetic diamond. The thermo-physical properties such as thermal expansion, heat capacity, thermal diffusivity and direct-current electrical conductivity were measured because they are influenced by filler content in the composite. The possible highest amount of the powder can slightly increase the thermal conductivity and decrease the thermal expansion of the system to an acceptable value needed for the coating of CCs. A side effect is simultaneous drop of heat capacity; however, its value stays still high enough for the purpose of heat sinking. Overall, the best results were achieved in system with 20 vol% of SiC filler in Stycast 2850FT + Catalyst 23LV resin matrix. There the contribution of the semiconducting SiC addition to the electrical conductivity of composite was negligible.
机译:高温超导涂层导体(CC)是用于高压电阻故障电流限制器的吸引力材料。商业生产的CC磁带不能承受超过100 V m(-1)的电场,因此,必须通过添加热稳定层来改变它们。我们研究了几种适用于这种热稳定的复合系统。作为复合材料的基质,使用脱藻树脂,其含有来自SiC,SiO 2,PBTIO3,ZrW2O8或合成金刚石的各种粉末颗粒含量。测量热膨胀,热容量,热扩散性和直流电导率的热物理性质,因为它们受复合材料中的填充物含量的影响。可能的最高量的粉末可以略微增加导热率,​​并将系统的热膨胀降低到CCS涂覆所需的可接受的值。副作用是热容量的同时滴;然而,由于散热的目的,其价值仍然足够高。总体而言,在SycastAct 2850ft +催化剂23LV树脂基质中具有20 Vol%的SiC填料的系统中获得了最佳结果。在那里,半导体SiC与复合材料的电导率的补充是可忽略不计的。

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