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首页> 外文期刊>Journal of Materials Processing Technology >A digital approach to automatically assess the machining-induced microstructural surface integrity
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A digital approach to automatically assess the machining-induced microstructural surface integrity

机译:一种自动评估加工诱导的微观结构表面完整性的数字方法

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When it comes to advanced materials for safety-critical applications, the evaluation of the machining-induced microstructural surface integrity represents a primary aspect within the assessment of part quality. Nowadays, presence and extent of machining-induced microstructural anomalies in the workpiece subsurface is manually measured by human inspection of digital micrographs. In the present work, computer-based performance of this task is achieved through a set of algorithms designed to automatically identify microstructural anomalies resulting from material removal operations. Digital surface integrity assessment has been demonstrated with application to scanning electron micrographs exhibiting different levels of microstructural deformation and obtained under different imaging conditions. Furthermore, the digitally detected material condition has been investigated with the support of in-depth field emission gun scanning electron microscopy (FEG-SEM) and electron backscatter diffraction (EBSD) analysis. This has allowed the relationship between the material evidence observed through different strategies to be established. Finally, the set of algorithms has been applied to study the microstructural condition of a large material region, by performing sequential processing of a series of micrographs. In this way, the measurement procedure has been calibrated and its capability to perform surface-integrity evaluation on large areas in an automated and standardised way has been demonstrated.
机译:当涉及到用于安全关键应用先进的材料,加工引起的微观结构的表面完整性的评价表示部质量评估内的主要方面。如今,在工件表面下的加工引起的微观结构的异常的存在和程度的手动数字显微照片的人工检查测量。另外,在本工作中,这个任务的基于计算机的性能是通过一组设计成自动识别从材料去除操作所得的微结构的异常的算法来实现的。数字表面完整性评估已经证实与应用到扫描电子显微照片显示出不同水平的微结构的变形和不同的成像条件下获得。此外,数字化检测材料状态进行了研究的支持深入场发射枪扫描电子显微镜(FEG-SEM)和电子背散射衍射(EBSD)分析的。这允许建立通过不同的策略中观察到的物证之间的关系。最后,集的算法已经被用于研究大量材料区域的微观结构情况下,通过一系列显微照片的执行顺序处理。以这种方式,在测量过程已被校准和其能力,已经证明上以自动化和标准化的方式大面积进行表面完整性评估。

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