首页> 外文期刊>Journal of Alloys and Compounds: An Interdisciplinary Journal of Materials Science and Solid-state Chemistry and Physics >Process optimization, microstructures and mechanical properties of a Cu-based shape memory alloy fabricated by selective laser melting
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Process optimization, microstructures and mechanical properties of a Cu-based shape memory alloy fabricated by selective laser melting

机译:通过选择性激光熔化制造的Cu基形状记忆合金的过程优化,微观结构和力学性能

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The Cu-13.5Al-4Ni-0.5Ti copper-based shape memory alloys (SMAs) were fabricated by selective laser melting (SLM). The parameters were optimized to obtain almost fully dense copper-based SMAs samples. The phases and microstructures were characterized and the tensile properties at room temperature and 200 degrees C were evaluated. The XRD results showed that only the beta 1' phase could be detected in the Cu-based SMAs, which was attributed to the extremely short solidification time for the precipitation of alpha and gamma(2) phases during SLM process. The grains were well refined and the average grain size was approximate 43 mu m, which was much smaller than that of the cast copper-based SMAs. The X-phase (Cu2TiAl) is observed, which is granular and size 20-50 nm. The Cu-13.5Al-4Ni-0.5Ti copper-based SMAs fabricated by SLM exhibited excellent mechanical properties at room temperature, which was higher than that of the cast copper-based SMAs. This is attributed to two aspects: (1) grain refinement, (2) suppress of brittle gamma(2) phase. Remarkably, the tensile test results at 200 degrees C showed both higher strength and elongation, which is attributed to the bcc structure of the parent phase and the stress-induced martensitic transformation at 200 degrees C. Meanwhile, the difference of microstructures and properties between SLM-fabricated Cu-based SMAs and casting Cu-based SMAs were analyzed and discussed in detail. (C) 2019 Elsevier B.V. All rights reserved.
机译:通过选择性激光熔化(SLM)制造Cu-13.5Al-4Ni-0.5TI铜基形状记忆合金(SMA)。优化参数以获得几乎完全致密的基于铜的SMA样品。表征各阶段和微观结构,并评估室温下的拉伸性能和200℃。 XRD结果表明,只有在基于Cu的SMA中可以检测到β1'相,这归因于SLM过程中α和γ(2)相的极短固化时间。晶粒精制良好,平均晶粒尺寸近似43μm,比铸造铜的SMA小得多。观察到X相(Cu2tial),其是颗粒状和尺寸20-50nm。通过SLM制造的Cu-13.5Al-4Ni-0.5TI铜基SMA在室温下表现出优异的机械性能,其高于铸造铜的SMA。这归因于两个方面:(1)晶粒细化,(2)抑制脆性γ(2)相。值得注意的是,200摄氏度的拉伸试验结果显示出较高的强度和伸长率,其归因于母相的BCC结构和200摄氏度的应力诱导的马氏体转变。同时,SLM之间的微观结构和性质的差异分析并详细地讨论了与基于Cu基的SMA和铸造Cu基SMA。 (c)2019 Elsevier B.v.保留所有权利。

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