首页> 外文期刊>Journal of Alloys and Compounds: An Interdisciplinary Journal of Materials Science and Solid-state Chemistry and Physics >The influence of pre-sintering temperature on the microstructure and properties of infiltrated ultrafine-grained tungsten-copper composites
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The influence of pre-sintering temperature on the microstructure and properties of infiltrated ultrafine-grained tungsten-copper composites

机译:预烧结温度对渗透超细晶粒钨铜复合材料微观结构和性能的影响

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In this work, several ultrafine-grained W-Cu composites were prepared by sintering at different temperatures of 1050 degrees C, 1150 degrees C, 1250 degrees C and 1350 degrees C of 2 h followed by traditional infiltration. The sintering kinetics of tungsten particles, as well as the resultant density, mechanical properties including hardness and compressive behavior, and electrical properties including electrical conductivity and arc erosion behavior of the infiltrated composites were investigated comparatively. Results revealed that the composite pre-sintered at 1250 degrees C with the highest tungsten particle contiguity of 0.45 exhibited the highest hardness of 272 HV and compressive strength of 894.0 MPa with a pronounced deformation plasticity; besides, the good sinterability of its microstructure contributed to a well dispersed arc spots over 50 times of electrical breakdown tests, resulting in a superior and reliable electrical breakdown strength of 5.66 x 10(7) V/m. (C) 2020 Elsevier B.V. All rights reserved.
机译:在这项工作中,几个超细晶W-Cu复合材料是通过在C,1150℃,1250℃,2小时1350摄氏度的1050度不同的温度,随后传统浸润烧结制备。钨粒子,以及所得到的密度,机械性能,包括硬度和压缩行为,性能和电性能包括导电性和渗透复合材料的电弧侵蚀行为的烧结动力学比较进行了研究。结果表明在1250℃下与0.45最高钨粒子邻接该复合预烧结表现出272 HV和894.0兆帕的压缩强度具有显着的变形塑性的硬度最高;除此之外,它的显微组织的良好烧结促进了良好分散飞弧的电击穿试验50次斑,导致5.66×10(7)V / m的优良和可靠的电击穿强度。 (c)2020 Elsevier B.v.保留所有权利。

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