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首页> 外文期刊>Journal of Applied Polymer Science >Construction of an in situ interfacial layer for aramid fiber reinforced styrene butadiene rubber composites
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Construction of an in situ interfacial layer for aramid fiber reinforced styrene butadiene rubber composites

机译:用于芳族纤维增强苯乙烯丁二烯橡胶复合材料的原位界面构建

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In this work, the in situ interface layer composite was prepared by using the coating agent dispersion. Aramid fiber (AF) was modified with lithium chloride aqueous solution, and then coated with the blends of a low-molecular weight maleated polybutadiene liquid rubber (MLPB), the epoxy resin (E51), and 2-ethyl-4-methylimidazole (2E4MZ). The in situ interface layer was formed via the reaction of epoxy group with anhydride group in the presence of the accelerator 2E4MZ and covulcanization of MLPB with styrene butadiene rubber (SBR) in the process of preparing vulcanized AF reinforced SBR. It can be seen from analysis of scanning electronic microscopy, attenuated total reflection Fourier transform infrared, and thermogravimetric analysis that the in situ interfacial layer was a uniform and dense interfacial layer on the fiber surface and was not be destroyed during processing. The results of the dynamic mechanical analysis and mechanical properties showed that the in situ interface layer formed in processing had higher flexibility and better integrity than the interface layer prepared before processing, which is favorable for stress relaxation, and the in situ interface layer imparts better tensile strength and tear strength to the composite. The 100% modulus of composites with in situ interface layers was 14.6% higher than that of composites prepared without uncoated AF.
机译:在这项工作中,通过使用涂布剂分散体制备原位界面层复合材料。用氯化锂水溶液改性芳族纤维(AF),然后用低分子量的马来酸盐聚丁二烯液橡胶(MLPB)的共混物,环氧树脂(E51)和2-乙基-4-甲基咪唑(2E4MZ )。通过在制备硫化AF加强SBR的过程中,通过在促进剂2E4MZ与苯乙烯丁二烯橡胶(SBR)的加速器2e4Mz和MLPB的核化的情况下,通过与酸酐基团的反应形成原位界面层。从扫描电子显微镜分析可以看出,减弱总反射傅里叶变换红外线,以及在原位界面层是纤维表面上均匀且致密的界面层的热重分析,并且在加工过程中没有被破坏。动态机械分析和机械性能的结果表明,在加工中形成的原位界面层具有更高的柔韧性和比加工前的界面层更好的完整性,这有利于应力松弛,并且原位界面层赋予更好的拉伸对复合材料的力量和撕裂力量。具有原位界面层的100%复合体积比没有未涂层的无涂层制备的复合材料的复合材料模量高14.6%。

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