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The process of surface carburization and high temperature wear behavior of infiltrated W-Cu composites

机译:渗透渗透的表面渗碳和高温磨损行为的过程

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摘要

Tungsten-copper (W-Cu) composites are used as high temperature frictional materials under special service conditions for electromagnetic gun rail and precision guide for rolled pieces due to their good ablation resistance and electrical conductivity. However, they have poor wear resistance at elevated temperatures. In this paper, surface carburization method was applied on the W-20 wt%Cu composite to investigate the mechanisms of carburization and its effects on the high temperature friction behavior of composite. Carburization process has been done at a temperature of 1100 degrees C for 30 h. The obtained results showed that carburizing at 1100 degrees C with a dwelling time of 30 h resulted into formation of a carburized layer and a dense intermediate sub-layer on the substrate. Also, the surface carburized layer with a thickness of about 70 pm composed of mixed phases of graphite, WC and W2C. The hardness of carburized layer (similar to HV454) was significantly higher than that of substrate (HV223). Also, bending strength of the carburized W-Cu composites has been significantly improved, although their electrical conductivity and tensile strength was decreased slightly. The carburization mechanism of the W-Cu composites was found to be dominant by carbon atom diffusion through reaction with W atoms and formation of surface liquid copper, which promoted migration and diffusion of tungsten and carbon at high temperatures. Average coefficients of friction and wear rate of carburized W-Cu composites are all lower than these of un-carburized W-Cu composites owing to the presence of surface carburized layer. Also, formation of CuWO4 at high temperatures reduced the friction and wear resistance of the W-Cu composites.
机译:钨铜(W-Cu)复合材料在电磁枪导轨和轧制件的电磁枪轨道和精密引导下用作高温摩擦材料,因为它们具有良好的消融电阻和导电性。然而,它们在升高的温度下耐磨性差。本文施加在W-20wt%Cu复合材料上的表面渗碳方法,研究渗碳机制及其对复合材料高温摩擦行为的影响。渗碳过程已经在1100℃的温度下进行30小时。所得结果表明,在1100摄氏度下渗碳为30小时,导致渗碳层的形成和基材上的致密中间子层。而且,表面渗碳层的厚度为约70μm,由石墨,WC和W2C的混合相组成。渗碳层的硬度(类似于HV454)显着高于基材(HV223)的硬度。而且,渗碳的W-Cu复合材料的弯曲强度得到了显着改善,尽管它们的电导率和拉伸强度略微降低。发现W-Cu复合材料的渗碳机制通过与W原子的反应和表面液体铜的反应而通过碳原子扩散,促进钨和碳在高温下的迁移和扩散。由于表面渗碳层的存在,渗碳的W-Cu复合材料的平均摩擦系数和磨损率均低于未渗碳的W-Cu复合材料。而且,在高温下形成CuWO4降低了W-Cu复合材料的摩擦和耐磨性。

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