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首页> 外文期刊>Polymer: The International Journal for the Science and Technology of Polymers >Interdiffusion versus crystallization at semicrystalline interfaces of sintered porous materials
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Interdiffusion versus crystallization at semicrystalline interfaces of sintered porous materials

机译:在烧结多孔材料的半结晶界面上的间隔与结晶

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Sintering process at temperature intervals close to the melting point of polymers is greatly important due to its role in synthesizing porous materials. During sintering, particles of polymeric materials coalesce throughout a process called interdiffusion. On the contrary, crystallization strongly affects the interdiffusion process at temperature intervals below and close to the melting point. Apparently, the outcome of the contention between these two factors would determine the interfacial width. Therefore, the current study presents a model, which takes both crystallization and interdiffusion into account, to predict sintering kinetic. Consequently, interfacial strength was assessed with respect to the following influencing mechanisms, "reentanglement" relying on mutual interpenetration distance and "cocrystallization" determined by interfacial lamellar thicknesses. Based on the results of the present study, by changing sintering temperature of high molecular weight high density polyethylene nascent powder from 125 to 129 degrees C, the mutual interpenetration distance changes from 4.8 to 52.9 nm and interfacial lamellae thicknesses also vary from L approximate to 0-35.4 nm. On the other hand, porosity measurements revealed the reverse dependency to the sintering temperature. Interfacial lamellae thicknesses were calculated by means of differential scanning calorimetry (DSC) and also scanning electron microscope (SEM) micrographs. Eventually, the results of the shear punch test clearly demonstrated the role of sintering temperature in interfacial strength. Accordingly, the maximum bearable load in the samples sintered at 125 and 129 degrees C, increases from 25 to 315 N, respectively, which was attributed to change in interfacial volume of two sintered particles in a simplified model. Resultantly, the present study indicates that even a degree centigrade temperature variation would significantly affect the interfacial strength and porosity of the samples due to i
机译:由于其在合成多孔材料中的作用,靠近聚合物熔点的温度间隔的烧结过程非常重要。在烧结过程中,聚合物材料的颗粒在整个过程中的一个被称为间隔的过程中。相反,结晶强烈地影响下面的温度间隔并靠近熔点的相互作用。显然,这两个因素之间的争用结果将决定界面宽度。因此,目前的研究提出了一种模型,其考虑了结晶和相互积分,以预测烧结动力学。因此,对以下影响机制评估了界面强度,“重新应入”依赖于互相互相距离和通过界面层状厚度确定的“环晶”。基于本研究的结果,通过改变高分子量高密度聚乙烯新生粉末的烧结温度从125〜129℃,互相互相距离从4.8到52.9 nm变化,界面薄片厚度也不同于l近似值。 -35.4 nm。另一方面,孔隙率测量揭示了对烧结温度的反向依赖性。通过差示扫描量热法(DSC)和扫描电子显微镜(SEM)显微照片计算界面薄片厚度。最终,剪切冲击试验的结果清楚地证明了烧结温度在界面强度中的作用。因此,在125和129℃下烧结的样品中的最大可耐受载荷分别从25至315n增加,这归因于在简化模型中的两个烧结颗粒的界面体积的变化。结果,目前的研究表明,即使是摄氏度的温度变化也会显着影响样品的界面强度和孔隙率

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