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首页> 外文期刊>Physica, C. Superconductivity and its applications >Microstructural study of brass matrix internal tin multifilamentary Nb3Sn superconductors
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Microstructural study of brass matrix internal tin multifilamentary Nb3Sn superconductors

机译:黄铜矩阵内部锡多丝NB3SN超导体的微观结构研究

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Zn addition to the Cu matrix in internal-tin-processed Nb3Sn superconductors is attractive in terms of the growth kinetics of the Nb3Sn layers. Sn activity is enhanced in the Cu-Zn (brass) matrix, which accelerates Nb3Sn layer formation. Here, we prepared multifilamentary wires using a brass matrix with a Nb core diameter of less than 10 mu m and investigated the potential for further J(c) improvement through microstructural and microchemical studies. Ti was added into the Sn cores in the precursor wire. Microchemical analysis showed that Ti accumulates between subelements consisting of Nb cores, which blocks Sn diffusion through this region when the spacing between the subelements in the precursor wire is a few microns. The average grain size was found to be about 230 nm through image analysis. To date, matrix J(c) values of 1470 and 640 A/mm(-2) have been obtained at 12 and 16 T, respectively. The area fraction of Nb cores in the filamentary region of the precursor wire was about 36.3%. There was still some unreacted Nb core area after heat treatment. Insufficient Ti diffusion into the Nb-3 Sn layers was identified in the outer subelements. These findings suggest that there is still room for improvement in J(c). (C) 2017 Elsevier B.V. All rights reserved.
机译:在内锡处理的NB3SN超导体中加入Cu基质的添加是在NB3SN层的生长动力学方面具有吸引力。 Cu-Zn(黄铜)基质中增强了Sn活性,其加速Nb3sn层形成。在这里,我们使用具有小于10μm的Nb芯直径的黄铜基质制备了多丝线,并通过微型结构和微型化学研究研究了进一步的J(c)改善的可能性。将Ti加入前体丝中的Sn核心中。微型化学分析表明,当前体丝的子元件之间的间隔是几微米时,Ti在由Nb芯组成的子元素之间累积,其通过该区域阻断Sn扩散。通过图像分析发现平均粒度约为230nm。迄今为止,已经分别在12和16t中获得了1470和640a / mm(-2)的矩阵j(c)值。前体丝丝状区域中Nb芯的面积分数约为36.3%。热处理后仍有一些未反应的NB核心区域。在外部子座中鉴定了在外部子元素中鉴定到Nb-3 Sn层中的Ti扩散不足。这些发现表明J(c)仍有改进的余地。 (c)2017年Elsevier B.V.保留所有权利。

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