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Local oxidation and reduction of graphene

机译:局部氧化和石墨烯的减少

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Micrometer sized oxidation patterns were created in chemical vapor deposition grown graphene through scanning probe lithography (SPL) and then subsequently reduced by irradiation using a focused x-ray beam. Throughout the process, the films were characterized by lateral force microscopy, micro-Raman and micro-x-ray photoelectron spectroscopy. Firstly, the density of grain boundaries was found to be crucial in determining the maximum possible oxygen coverage with SPL. Secondly, the dominant factor in SPL oxidation was found to be the bias voltage. At low voltages, only structural defects are formed on grain boundaries. Above a distinct threshold voltage, oxygen coverage increased rapidly, with the duration of applied voltage affecting the final oxygen coverage. Finally, we found that, independent of initial conditions, types of defects or the amount of SPL oxidation, the same set of coupled rate equations describes the reduction dynamics with the limiting reduction step being C-C -> C=C.
机译:通过扫描探针光刻(SPL)在化学气相沉积中产生微米尺寸的氧化模式,然后通过使用聚焦的X射线束通过照射随后减少。在整个过程中,薄膜的特征在于横向力显微镜,微拉曼和微X射线光电子能谱。首先,发现晶界密度在确定用SPL确定最大可能的氧气覆盖范围至关重要。其次,发现SPL氧化中的显性因子是偏置电压。在低电压下,在晶界上仅形成结构缺陷。在不同的阈值电压之上,氧气覆盖率迅速增加,施加电压的持续时间影响最终氧气覆盖率。最后,我们发现,独立于初始条件,缺陷类型或SPL氧化量,相同的一组耦合速率方程描述了具有限制还原步骤的减少动态,其是C-C - C = C.

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