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In situ investigation of copper corrosion in acidic chloride solution using atomic force-scanning electrochemical microscopy

机译:原子力扫描电化学显微镜原位研究酸性氯化物溶液中的铜腐蚀

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摘要

The anodic dissolution of pure copper surfaces in acidic chloride solution has been monitored in-situ using combined atomic force - scanning electrochemical microscopy (AFM-SECM). Here, the initial studies performed on model copper-modified substrates have been extended to the investigation of bulk copper samples used in industrial settings. The local release of Cu2+ ions was monitored through electrochemical reduction and deposition of the metal ions on the conductive frame of the AFM-SECM probe. Simultaneous monitoring of the topographical changes due to the corrosion process allowed the distinction and correlation of local passivation and pitting phenomena. The extent of the attack was estimated by anodic stripping of the copper metal deposited at the probe. (C) 2017 Elsevier Ltd. All rights reserved.
机译:使用组合原子力扫描电化学显微镜(AFM-SECM)原位监测纯铜表面纯铜表面的阳极溶解。 这里,对模型铜改性基材进行的初始研究已经扩展到工业环境中使用的散装铜样品的研究。 通过在AFM-SECM探针的导电框架上通过电化学还原和沉积金属离子的电化学还原和沉积Cu 2 +离子的局部释放。 同时监测由于腐蚀过程引起的地形变化允许局部钝化和点点现象的区别和相关性。 通过沉积在探针处的铜金属的阳极汽提来估计攻击程度。 (c)2017 Elsevier Ltd.保留所有权利。

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