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Optimizing strength and ductility in Cu-Al alloy with recrystallized nanostructures formed by simple cold rolling and annealing

机译:通过简单的冷轧和退火形成具有再结晶纳米结构的Cu-Al合金,优化强度和延展性

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摘要

A single-phase Cu-Al alloy with a low stacking fault energy was processed by cold rolling and subsequent annealing. Fully recrystallized microstructures composed of ultrafine grains were obtained after isothermal annealing at different temperatures. The minimum mean grain sizes achieved were below 1 μm. It was found that the microstructures were homogeneous after annealing at 400 °C, but somehow inhomogeneous after annealing at lower temperature of 300 °C and higher temperature of 550 °C. Superior strength and ductility were obtained by controlling the grain size of the microstructures. After annealing at 400 °C for 10 s, a fully and homogeneously recrystallized material with mean grain size of 770 nm was produced, which had a high yield strength of 524.2 MPa and a remarkable uniform elongation of 15.7 %.
机译:通过冷轧和随后的退火处理具有低堆垛层错能量的单相Cu-Al合金。在不同温度下等温退火后,获得了由超细晶粒组成的完全重结晶的显微组织。达到的最小平均晶粒尺寸小于1μm。发现在400℃下退火后,显微组织是均匀的,但是在较低的300℃和较高的550℃的退火下,微观结构是不均匀的。通过控制微结构的晶粒尺寸,可以获得卓越的强度和延展性。在400°C下退火10 s后,制得了平均晶粒尺寸为770 nm的完全均匀的再结晶材料,该材料具有524.2 MPa的高屈服强度和15.7%的显着均匀伸长率。

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