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首页> 外文期刊>Journal of Materials Science >Chemical bonding and interlocking between hydratable alumina and microsilica after drying at 110 ℃ and firing at 800 ℃
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Chemical bonding and interlocking between hydratable alumina and microsilica after drying at 110 ℃ and firing at 800 ℃

机译:在110℃干燥和800℃焙烧后,水合氧化铝与微硅石之间的化学结合和互锁。

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摘要

Chemical bond changes between microsilica and hydratable alumina were studied by X-ray photoelectron spectroscopy and Fourier transformation infrared spectroscopy. The formation of Si-O-Al bond was detected by the decreased O 1s and Si 2p binding energy and the lowered vibration frequency of hydratable alumina with the addition of microsilica after drying at 110 ℃ and heating at 800 ℃. Furthermore, it was observed by scanning electron microscope that the interlocking structure developed between the particles of hydratable alumina and microsilica after drying at 110 ℃ and the sintering took place among the particles after heating at 800 ℃. Therefore, it is proposed that the increased strength of the castables after drying and heat treatment at intermediate temperatures was attributed to the presence of microsilica which resulted in the formation of Si-O-Al bond and interlocking structure between hydratable alumina and microsilica particles.
机译:利用X射线光电子能谱和傅里叶变换红外光谱研究了微二氧化硅与水合氧化铝之间的化学键变化。在110℃干燥并在800℃加热后,通过添加O2s和Si 2p的结合能降低,水合氧化铝的振动频率降低,并加入微硅粉,可以形成Si-O-Al键形成。此外,通过扫描电子显微镜观察到,在110℃下干燥后,水合氧化铝颗粒与微二氧化硅之间形成了互锁结构,而在800℃下加热后,在这些颗粒之间发生了烧结。因此,提出在中温下干燥和热处理后,可浇铸材料的强度提高归因于微硅的存在,这导致了Si-O-Al键的形成以及水合氧化铝与微硅颗粒之间的互锁结构。

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