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首页> 外文期刊>Journal of Materials Science >Effect of aluminum on precipitation hardening in Cu-Ni-Zn alloys
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Effect of aluminum on precipitation hardening in Cu-Ni-Zn alloys

机译:铝对Cu-Ni-Zn合金中沉淀硬化的影响

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The effect of aluminum on the precipitation hardening of Cu-Ni-Zn alloys with varying aging temperatures and times was investigated in this article, in the hope to achieve better mechanical properties. Vickers hardness, tensile, and electrical conductivity tests were carried out to characterize the properties of the Cu-Ni-Zn alloys with or without an addition of aluminum subjected to different aging treatments. The results show that an addition of 1.2 wt% aluminum can play an influential role in the precipitation hardening of the Cu-Ni-Zn alloys. For example, it can increase the peak hardness from 58 Hv for the solution-treated Cu-10Ni-20Zn alloy to 185 Hv for the solution-treated Cu-10Ni-20Zn-1.2Al alloy during aging at 500 degrees C. The yield strength, tensile strength, and electrical conductivity of the Cu-10Ni-20Zn-1.2Al alloy subjected to suitable treatments under prior cold-rolled and aged conditions can reach 889 MPa, 918 MPa, and 10.96% IACS, respectively, being much higher than those of the relevant alloy without aluminum and comparable to those of the Cu-Be alloys (C17200 and C17510). According to the transmission electron microscope observations, it was found that formation of nanosized precipitates with the L1(2)-type ordered lattice results in precipitation hardening, and an orientation relationship of [011](p)//[011](m) and (100)(p)//(200)(m) exists between the precipitates and the alpha-Cu matrix.
机译:本文研究了铝在不同时效温度和时间下对Cu-Ni-Zn合金沉淀硬化的影响,以期获得更好的机械性能。进行了维氏硬度,抗张强度和电导率测试,以表征添加或不添加经过不同时效处理的铝的Cu-Ni-Zn合金的性能。结果表明,添加1.2 wt%的铝可以对Cu-Ni-Zn合金的沉淀硬化产生影响。例如,在500摄氏度时效时,它可以将峰值硬度从固溶处理的Cu-10Ni-20Zn合金的58 Hv增加到固溶处理的Cu-10Ni-20Zn-1.2Al合金的185 Hv。屈服强度在先前的冷轧和时效条件下进行适当处理的Cu-10Ni-20Zn-1.2Al合金的拉伸强度和电导率分别可以达到889 MPa,918 MPa和10.96%IACS,远高于那些不含铝且与铜铍合金(C17200和C17510)相当的相关合金的含量。根据透射电子显微镜的观察结果,发现具有L1(2)型有序晶格的纳米级沉淀物的形成导致沉淀硬化,并且取向关系为[011](p)// [011](m) (100)(p)//(200)(m)存在于析出物与α-Cu基体之间。

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