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Phase transition characteristics and electrical properties of nitrogen-doped GeSb thin films for PRAM applications

机译:用于PRAM的氮掺杂GeSb薄膜的相变特性和电性能

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摘要

We have investigated the nitrogen doping effect on phase transition characteristics and electrical property of nitrogen-doped GeSb (N-doped GS) thin films. The nitrogen gas flow rate changed from 0 sccm (GS(0)) to 6 sccm (GS(6)) during the deposition. The sheet resistance of crystalline state was increased from 2.6 to 5.1 ka"broken vertical bar/a- and thermal stability of amorphous was increased as nitrogen gas flow rate increased due to nitrogen doping effect. Moreover, the average grain size was decreased from 9.7 to 6.6 nm at 400 A degrees C as nitrogen gas flow rate increased. However, the crystallization threshold time and laser power of GS(6) were shorter and lower than GS(0) caused by lower optical reflectivity. Nitrogen-doped GeSb showed the possibility of low RESET power and high speed PRAM operation.
机译:我们研究了氮掺杂对掺氮GeSb(N掺杂GS)薄膜的相变特性和电性能的影响。沉积期间,氮气流速从0 sccm(GS(0))变为6 sccm(GS(6))。结晶态的薄层电阻从2.6增加到5.1 ka“,垂直条/ a-破坏,并且由于氮气的掺入效应,氮气流量增加,非晶态的热稳定性增加。此外,平均晶粒尺寸从9.7减小至随着氮气流量的增加,在400 A的温度下为6.6 nm,但是由于较低的光反射率,GS(6)的结晶阈值时间和激光功率比GS(0)短,但低于GS(0)。低复位功率和高速PRAM操作。

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