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Phase transition characteristics of Bi/Sn doped Ge_2Sb_2Te_5 thin film for PRAM application

机译:PRAM应用Bi / Sn掺杂Ge_2Sb_2Te_5薄膜的相变特性

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摘要

The Bi and Sn were doped to Ge_2Sb_2Te_5 (GST) to investigate and modify the phase transition characteristics. The Bi/Sn doped GST thin film was prepared by RF magnetron co-sputtering and its crystal structure, sheet resistance, and phase transition kinetics were analyzed. By the doping of Bi/Sn, the crystallization temperature or stable phase was changed slightly compared with GST. For the PRAM application, the optimum doping concentration was Bi 5.9 and Sn 17.7 at.%, and its minimum time for crystallization was shorten more than 30% compared with GST. The sheet resistance difference between amorphous and crystalline state was higher than 10~4 Ω/□.
机译:将Bi和Sn掺杂到Ge_2Sb_2Te_5(GST)中以研究和修改相变特性。通过射频磁控共溅射制备了Bi / Sn掺杂的GST薄膜,并对其晶体结构,薄层电阻和相变动力学进行了分析。通过Bi / Sn的掺杂,与GST相比,结晶温度或稳定相略有变化。对于PRAM应用,最佳掺杂浓度为Bi 5.9和Sn 17.7 at。%,并且与GST相比,其最短结晶时间缩短了30%以上。非晶态和结晶态的薄层电阻差大于10〜4Ω/□。

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