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Research on micro-electric resistance slip welding of copper electrode during the fabrication of 3D metal micro-mold

机译:3D金属微模具制造过程中铜电极微电阻滑焊的研究

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摘要

3D micro-mold fabricated by the micro double-staged laminated object manufacturing process (micro-DLOM) is formed via stacking and fitting of multi-layer 2D micro-structures. The connection of 2D micro-structures is related to forming accuracy and mechanical properties of 3D micro-mold. In this research, micro-electric resistance slip welding of copper electrodes was proposed to connect multilayer 2D micro-structures. Firstly, the proper process parameters of slip welding were obtained through the welding experiment, and the temperature field of micro-electric resistance slip welding under such process parameters was simulated. Secondly, deposition effect of the copper bar electrode produced during slip welding was studied and the study results show that the copper element deposited in the slip welding area decreases as the surface roughness of copper electrode decreases. Finally, based on the above research, a square micro-cavity mold with micro-channel, a circular micro-cavity mold with cross keyway and micro gear cavity mold with two-stage steps were welded by the micro-electric resistance slip welding.
机译:通过多层双层二维微结构的堆叠和装配,形成了由微双层叠层物体制造工艺(micro-DLOM)制造的3D微模具。 2D微结构的连接与3D微模具的成型精度和机械性能有关。在这项研究中,提出了铜电极的微电阻滑动焊接来连接多层二维微结构。首先,通过焊接实验获得了合适的滑动焊接工艺参数,并模拟了在该工艺参数下的微电阻滑动焊接的温度场。其次,研究了滑动焊接过程中产生的铜条电极的沉积效果,研究结果表明,随着铜电极表面粗糙度的降低,沉积在滑动焊接区域的铜元素减少。最后,在上述研究的基础上,通过微电阻滑焊焊接了具有微通道的方形微腔模具,具有十字键槽的圆形微腔模具和具有两级台阶的微齿轮腔模具。

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