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首页> 外文期刊>Journal of Alloys and Compounds: An Interdisciplinary Journal of Materials Science and Solid-state Chemistry and Physics >Porous silica ceramics with closed-cell structure prepared by inactive hollow spheres for heat insulation
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Porous silica ceramics with closed-cell structure prepared by inactive hollow spheres for heat insulation

机译:惰性空心球制备的具有闭孔结构的多孔二氧化硅陶瓷隔热

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摘要

Highly porous silica ceramics (PSCs) with closed-cell structure are fabricated via sintering of randomly packed hollow SiO2 spheres (HSSs), and the influences of sintering parameters, additives and physical features of HSSs on the structure and performance of prepared PSCs are discussed. The results show that the hollow structure of SiO2 spheres is reserved during the sintering process due to its low-activated shells and the sintered necks are finely formed among the hollow spheres, which results in both high porosity and superior strength of final products and thus meets the needs of heat shielding materials. In addition, the optimized PSCs are synthesized with sintering temperature of 1200-1250 degrees C and additive of 4 wt.% H3BO3 combining 6 wt.% Al2O3, and the increase of closed porosity of PSCs brings in the enhanced thermal shielding effect while the strength degrades. Furthermore, the structure analysis reveals that decreased cristobalite phase in the PSCs reduces the glass viscosity and increases the packing density of HSSs, which also prefers to enhance the mechanical strength and thermal insulation. As a result, thermal conductivity of about 0.102-0.218 W/(m.k) and compressive strength of 3.2-14 MPa are obtained in our synthesized products. (C) 2015 Elsevier B.V. All rights reserved.
机译:通过烧结无规填充空心SiO2球(HSSs),制备了具有闭孔结构的高孔隙度二氧化硅陶瓷(PSCs),并讨论了烧结参数,添加剂和HSS的物理特性对制备的PSCs结构和性能的影响。结果表明,SiO2球的空心结构由于其低活化的壳层而在烧结过程中得以保留,并且在空心球之间精细地形成了烧结颈,这导致了高孔隙率和最终产品的优异强度,因此满足隔热材料的需求。此外,在烧结温度为1200至1250摄氏度,添加剂为4%(重量)的H3BO3和6%(重量)的Al2O3的条件下合成了优化的PSC,PSC的封闭孔隙率的提高带来了增强的热屏蔽效果,而强度降级。此外,结构分析表明,PSC中方石英相的减少会降低玻璃粘度并增加HSS的堆积密度,这也倾向于提高机械强度和隔热性。结果,在我们的合成产品中获得了约0.102-0.218 W /(m.k)的导热率和3.2-14 MPa的抗压强度。 (C)2015 Elsevier B.V.保留所有权利。

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