首页> 外文期刊>Journal of Alloys and Compounds: An Interdisciplinary Journal of Materials Science and Solid-state Chemistry and Physics >Fabrication and characterization of copper-indium-diselenide (CuInSe2, CIS) thin film using one-step electro-deposition process
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Fabrication and characterization of copper-indium-diselenide (CuInSe2, CIS) thin film using one-step electro-deposition process

机译:一步法电沉积工艺制备铜铟二硒化物(CuInSe2,CIS)薄膜

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摘要

We had successfully fabricated CuInSe2 (CIS) thin film by electro-deposition technique. Electro-deposited ternary selenide precursor was thermally annealed under nitrogen conditions to form CuInSe2 films. The structure, composition, chemical state and optical characterization of CuInSe2 films were measured using several techniques, including Scanning electron microscopy (SEM), Atomic force microscopy (AFM), Atomic emission spectroscopy (AES), X-ray diffraction (XRD), X-ray photoelectron spectroscopy (XPS), Ultraviolet Spectrophotometry (UV) and electrochemical workstation. The results showed that the CuInSe2 thin films formed using electro-deposition had dense grain structure whose size was various with the increase of the deposited voltage and annealing temperature. The band gap of CuInSe2 was 1.43 eV when deposition voltage was 1.7 V, and CIS film exhibited the most excellent property. (C) 2015 Elsevier B.V. All rights reserved.
机译:我们已经通过电沉积技术成功地制造了CuInSe2(CIS)薄膜。在氮条件下对电沉积的三元硒化物前体进行热退火,以形成CuInSe2膜。使用多种技术测量了CuInSe2薄膜的结构,组成,化学状态和光学特性,包括扫描电子显微镜(SEM),原子力显微镜(AFM),原子发射光谱(AES),X射线衍射(XRD),X射线光电子能谱(XPS),紫外分光光度法(UV)和电化学工作站。结果表明,电沉积形成的CuInSe2薄膜具有致密的晶粒结构,其晶粒尺寸随沉积电压和退火温度的升高而变化。当沉积电压为1.7V时,CuInSe 2的带隙为1.43eV,并且CIS膜表现出最优异的性能。 (C)2015 Elsevier B.V.保留所有权利。

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