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首页> 外文期刊>Journal of Alloys and Compounds: An Interdisciplinary Journal of Materials Science and Solid-state Chemistry and Physics >Extremely low temperature coefficient of resistivity in antiperovskite compounds M_σGa_(1-σ)CFe_3 (M = Cu, Ag)
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Extremely low temperature coefficient of resistivity in antiperovskite compounds M_σGa_(1-σ)CFe_3 (M = Cu, Ag)

机译:抗钙钛矿化合物M_σGa_(1-σ)CFe_3(M = Cu,Ag)的极低电阻率温度系数

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摘要

We report the effects of substitution of Cu/Ag/Zn/Sn for Ga on the temperature coefficient of resistivity (TCR) of antiperovskite GaCFe_3. With both Cu and Ag dopants increasing, the resistivity displays a peak over a broad temperature range (or low TCR value) around room temperature. As a result, the Cu/Ag dopant can sufficiently optimize the TCR value. For Ag_(0.05)Ga_(0.95)CFe_3, the averaged TCR values are less than 10.74 ppm/K (215-350 K) and, especially, as low as 2.51 ppm/K (260-300 K). Similarly, the averaged TCR values are 28.87 ppm/K (220-273 K) in Cu_(0.05)Ga_(0.95)CFe_3 and 19.20 ppm/K (235-287 K) in Cu_(0.1)Ga_(0.9)-CFe_3. Considering the extremely low averaged TCR value, broad temperature range around room temperature, friendly to the environment, and good thermostability, the series of Cu_xGa_(1-x)CFe_3 and Ag_xGa_(1-x) CFe_3 can be promising low TCR materials.
机译:我们报道了Ga / Cu / Ag / Zn / Sn取代对钙钛矿GaCFe_3电阻率温度系数(TCR)的影响。随着铜和银掺杂剂的增加,电阻率在室温附近的较宽温度范围(或较低的TCR值)上显示出峰值。结果,Cu / Ag掺杂剂可以充分地优化TCR值。对于Ag_(0.05)Ga_(0.95)CFe_3,平均TCR值小于10.74 ppm / K(215-350 K),尤其是低至2.51 ppm / K(260-300 K)。类似地,在Cu_(0.05)Ga_(0.95)CFe_3中的平均TCR值为28.87 ppm / K(220-273 K),在Cu_(0.1)Ga_(0.9)-CFe_3中为19.20 ppm / K(235-287 K)。考虑到极低的平均TCR值,室温附近较宽的温度范围,对环境友好以及良好的热稳定性,Cu_xGa_(1-x)CFe_3和Ag_xGa_(1-x)CFe_3系列可以成为低TCR材料。

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