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首页> 外文期刊>Journal of Applied Polymer Science >Effect of Polymer Structure on the Morphologies and Dielectric Properties of Nanoporous Polyimide Films
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Effect of Polymer Structure on the Morphologies and Dielectric Properties of Nanoporous Polyimide Films

机译:聚合物结构对纳米多孔聚酰亚胺薄膜形貌和介电性能的影响

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Low dielectric constant polyimide (PI) films have potential applications in integrated circuit. In this study, poly(methyl methacrylate), poly(ethylene oxide), and polystyrene as thermally labile materials were used as templates to generate PI films with nanopores by first mixing the polymer templates with the precursor of PI, poly(amic acid), followed by imidization of poly(amic acid) together with degradation of the polymer templates. The sizes of the formed pores, the thermal and dielectric constant of the nanofoamed PI films were studied and compared in detail. It is concluded that the dielectric constant of PI films using poly(ethylene oxide) as pore template is more stable because of the formation of uniform pores which is from the great accordance of imidization temperature of poly(amic acid) with the degradation temperature of poly(ethylene oxide). But that using poly(methyl methacrylate) as pore template is frequency dependent as the influence of inhomogeneous pores and PMMA residue from incompletely degradation of poly(methyl methacrylate). (C) 2014 Wiley Periodicals, Inc.
机译:低介电常数聚酰亚胺(PI)膜在集成电路中具有潜在的应用。在这项研究中,以聚甲基丙烯酸甲酯,聚环氧乙烷和聚苯乙烯为热不稳定材料作为模板,通过首先将聚合物模板与PI的前体聚酰胺酸混合,生成具有纳米孔的PI膜,然后酰亚胺化聚(酰胺酸)以及降解聚合物模板。研究并比较了形成的孔的大小,纳米发泡PI膜的热常数和介电常数。结论是,由于聚酰胺酸的酰亚胺化温度与聚酰亚胺的降解温度有很大关系,因此以聚环氧乙烷为孔模板的PI薄膜的介电常数更稳定,这是因为形成了均匀的孔。 (环氧乙烷)。但是使用聚甲基丙烯酸甲酯作为孔模板的方法是频率依赖性的,因为聚甲基丙烯酸甲酯的不完全降解会导致不均匀的孔和PMMA残留物的影响。 (C)2014威利期刊公司

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