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A simple imide compound as a curing agent for epoxy resin. I. Synthesis and properties

机译:一种简单的酰亚胺化合物,可作为环氧树脂的固化剂。一,合成与性能

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A simple imide compound, 4-amino-phthalimide (APH), was synthesized as a curing agent for epoxy resin. APH was prepared from the hydration of 4-nitro-phthalimide, which was prepared from the nitration of phthalimide. The chemical structure of APH was verified by IR and H-1-NMR spectra. The thermal properties and dielectric constant (epsilon) of a phosphorus-containing novolac epoxy resin cured by APH were determined and compared with those of epoxy resins cured by either 4,4'-diamino diphenyl methane (DDM) or 4,4'-diamino diphenyl sulfone (DDS). The results indicate that the epoxy resin cured by APH showed better thermal stability and a lower epsilon than the polymer cured by either DDM or DDS. This was due to the introduction of the imide group of APH into the polymer structure. (C) 2008 Wiley Periodicals, Inc.
机译:合成了一种简单的酰亚胺化合物4-氨基邻苯二甲酰亚胺(APH)作为环氧树脂的固化剂。 APH由4-硝基邻苯二甲酰亚胺的水合制备,后者是由邻苯二甲酰亚胺的硝化制备的。 APH的化学结构通过IR和H-1-NMR光谱验证。确定了通过APH固化的含磷线型酚醛环氧树脂的热性能和介电常数(ε),并将其与通过4,4'-二氨基二苯甲烷(DDM)或4,4'-二氨基固化的环氧树脂进行比较二苯砜(DDS)。结果表明,用APH固化的环氧树脂比用DDM或DDS固化的聚合物表现出更好的热稳定性和更低的ε。这是由于将APH的酰亚胺基团引入聚合物结构中。 (C)2008 Wiley期刊公司

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