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首页> 外文期刊>Journal of Applied Polymer Science >Metallization of UV-cured acrylate resins by reduction of polymer-incorporated cobalt ion
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Metallization of UV-cured acrylate resins by reduction of polymer-incorporated cobalt ion

机译:通过减少聚合物结合的钴离子对UV固化的丙烯酸酯树脂进行金属化

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The surface of UV-cured films of poly(ethylene glycol) diacrylate (PEGAc)/tetrahydrofurfuryl acrylate (THFAc) (weight ratio 100/0, 90/10, and 80/20) was metallized by the reduction of polymer-incorporated cobalt chloride with aqueous sodium borohydride at 20 degrees C. The electron probe microanalysis (EPMA) and X-ray photoelectron spectroscopy measurement revealed that the cobalt ion, which was homogeneously distributed in the inner part of the film before reduction, migrated to both sides of the film, and then reduced to pure metal by the reduction treatment. The surface resistance of the UV-cured PEGAc/THFAc film increased with increasing THFAc content. Especially, the trend was prominent at the glass side of the metallized films. The glass transition temperature of the cured resin measured by dynamic viscoelastic analysis slightly rose with an increase of THFAc content. The EPMA map of cobalt and carbon in the depth direction of the metallized film showed that the cobalt layer, generated at the glass side of the film with a higher THFAc content, contains more polymer component, in agreement with the order of surface resistance. The X-ray diffraction analysis of the reduced films revealed that the degree of crystallinity of the generated cobalt was low. (c) 2005 Wiley Periodicals, Inc.
机译:聚乙二醇二丙烯酸酯(PEGAc)/丙烯酸四氢糠酯(THFAc)(重量比100 / 0、90 / 10和80/20)的UV固化膜的表面通过减少结合有聚合物的氯化钴金属化用硼氢化钠水溶液在20摄氏度下进行。电子探针微分析(EPMA)和X射线光电子能谱测量表明,还原前均匀分布在薄膜内部的钴离子迁移到薄膜的两侧,然后通过还原处理还原为纯金属。紫外线固化的PEGAc / THFAc膜的表面电阻随THFAc含量的增加而增加。特别是,该趋势在金属化膜的玻璃侧显着。通过动态粘弹性分析测得的固化树脂的玻璃化转变温度随THFAc含量的增加而略有上升。 EPMA在金属化膜的深度方向上的钴和碳的图谱表明,在膜的玻璃侧产生的具有较高THFAc含量的钴层,按照表面电阻的顺序,含有更多的聚合物组分。还原膜的X射线衍射分析表明,生成的钴的结晶度低。 (c)2005年Wiley Periodicals,Inc.

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