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Material characterization of a high-dielectric-constant polymer-ceramic composite for embedded capacitor for RF applications

机译:用于射频应用的嵌入式电容器的高介电常数聚合物-陶瓷复合材料的材料表征

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Embedded capacitor technology can improve electrical performance and reduce assembly cost compared with traditional discrete capacitor technology. Polymer-ceramic composites have been of great interest as embedded capacitor materials because they combine the processability of polymers with the desired electrical properties of ceramics. We have developed a novel nariostructure polymer-ceramic composite with a very high dielectric constant (e(r) approximate to 150, a new record for the highest reported e(r) value of a nanocomposite) in a previous work. RF applications of embedded capacitors require that the insulating material have a high e(r) at a high frequency (in the gigahertz range), low leakage current, high breakdown voltage, and high reliability. A set of electrical tests were conducted in this study to characterize the electrical properties of the novel high-e(r) polymer-ceramic nanocomposite developed inhouse. The results show that this material had a fairly high e(r) in the RF range, low electrical leakage, and high breakdown voltage. An 85degreesC/85% thermal humidity aging test was been performed, and it showed that this novel high-K material had good reliability. An embedded capacitor prototype with a capacitance density of 35 nF/cm(2) was manufactured with this nanocomposite with spin-coating technology. This novel nanocomposite can be used for the integral capacitors for RF applications. (C) 2004 Wiley Periodicals, Inc. [References: 7]
机译:与传统的分立电容器技术相比,嵌入式电容器技术可以改善电气性能并降低组装成本。聚合物-陶瓷复合材料作为嵌入式电容器材料备受关注,因为它们将聚合物的加工性能与所需的陶瓷电性能结合在一起。在先前的工作中,我们已经开发出具有非常高的介电常数(e(r)约为150,这是纳米复合材料报告的最高e(r)值的新记录)的新型纳米结构聚合物-陶瓷复合材料。嵌入式电容器的RF应用要求绝缘材料在高频下(千兆赫兹范围内)具有高e(r),低泄漏电流,高击穿电压和高可靠性。在这项研究中进行了一组电气测试,以表征内部开发的新型高e(r)聚合物-陶瓷纳米复合材料的电性能。结果表明,该材料在RF范围内具有相当高的e(r),低漏电和高击穿电压。进行了85℃/ 85%的热湿老化试验,结果表明该新型高K材料具有良好的可靠性。用这种纳米复合材料通过旋涂技术制造了一种电容密度为35 nF / cm(2)的嵌入式电容器原型。这种新颖的纳米复合材料可用于射频应用的集成电容器。 (C)2004 Wiley Periodicals,Inc. [参考:7]

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