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首页> 外文期刊>Physical Review, B. Condensed Matter >Theoretical and experimental study of the quasistatic capacitance of metal-insulator hydrogenated amorphous silicon structures: Strong evidence for the defect-pool model
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Theoretical and experimental study of the quasistatic capacitance of metal-insulator hydrogenated amorphous silicon structures: Strong evidence for the defect-pool model

机译:金属绝缘体氢化非晶硅结构准静态电容的理论和实验研究:缺陷池模型的有力证据

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The density of localized states in hydrogenated amorphous silicon (a-Si:H) is studied by means of the quasistatic capacitance technique applied to metal-insulator a-Si:H structures. Calculations in the framework of the defect-pool model show that the changes in the quasistatic capacitance versus gate bias curves (qs-CV curves) after bias annealing reveal the changes in the density of dangling-bond states predicted by the model, and are sensitive to the defect-pool parameters. The comparison of theoretical qs-CV curves with experimental curves obtained in a wide range of bias-anneal voltages V-ba on several kinds of structures (top gate oxide, top gate nitride, and the most commonly used bottom gate nitride structures) strongly support the defect-pool model, and values for the model parameters are deduced, it is shown that for all structures the dominant phenomenon for bias annealing at positive V-ba (i.e., under electron accumulation) is the creation of defects in the lower part of the gap in the a-Si:H. Bias annealing under hole accumulation reveals the creation of defects in the upper part of the gap of a-Si:H, but the precise dependence of the qs-CV curves upon V-ba depends on the nature of the insulator-a-Si:H interface. In particular, it is affected by a higher density of interface trap levels in the top gate nitride structures, and by hole injection and trapping from the a-Si:H into the nitride layer in the bottom gate nitride structures. [S0163-1829(98)03040-9]. [References: 29]
机译:借助应用于金属绝缘体a-Si:H结构的准静态电容技术,研究了氢化非晶硅(a-Si:H)中的局部态密度。缺陷池模型框架内的计算表明,偏置退火后的准静态电容与栅极偏置曲线(qs-CV曲线)的变化揭示了该模型预测的悬空键态密度的变化,并且很敏感。缺陷池参数。有力地支持了几种结构(顶栅氧化物,顶栅氮化物和最常用的底栅氮化物结构)的理论qs-CV曲线与在宽范围的偏置退火电压V-ba中获得的实验曲线的比较缺陷池模型,并推导模型参数的值,结果表明,对于所有结构,在正V-ba(即在电子积累下)进行偏置退火的主要现象是在下部的缺陷的产生。 a-Si:H中的间隙。空穴累积下的偏压退火揭示了在a-Si:H间隙的上部产生缺陷,但是qs-CV曲线对V-ba的精确依赖性取决于绝缘体-a-Si的性质: H接口。特别地,它受到顶部栅极氮化物结构中界面陷阱能级的更高密度以及空穴注入和从a-Si:H捕获到底部栅极氮化物结构中的氮化物层中的影响。 [S0163-1829(98)03040-9]。 [参考:29]

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