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首页> 外文期刊>Physical chemistry chemical physics: PCCP >Adjusting the thermoelectric properties of copper(I) oxide-graphite-polymer pastes and the applications of such flexible composites
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Adjusting the thermoelectric properties of copper(I) oxide-graphite-polymer pastes and the applications of such flexible composites

机译:调节氧化铜-石墨-聚合物糊料的热电性能以及这种柔性复合材料的应用

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摘要

We present a facile alternative to other well known strategies for synthesizing flexible thermoelectric materials. Instead of printing thin active layers on flexible substrates or doping conductive polymers, we produce thermoelectric pastes, using a mixture of graphite, copper(I) oxide and polychlorotrifluoroethene. The Seebeck coefficient of the investigated pastes varies between 10 and 600 mu V K-1, while the electrical conductivity spans over an even wider range of 10(-4) to 10(2) S m(-1). Here, the influence of phenomena such as percolation on the electrical transport is revealed. The resulting power factor reaches 5.69 x 10(-4) +/- 0.70 x 10(-4) mu W m(-1) K-2 for the graphite-polymer paste, with an unexpected minimum at a graphite molar fraction of approximately 0.4. The values are comparable to those of the powder mixtures, which are slightly higher, but less precisely tunable. Such compounds are further evaluated for practical applications. The graphite-polymer paste is used to exemplify, how a flexible thermoelectric sensor can be easily manufactured, step by step. Our results represent a proof of principle, that thermoelectric pastes are viable alternatives to current solutions. A further expansion of the scope for the composites can be achieved by using high performance thermoelectric materials and conductive polymers.
机译:我们提出了一种简便的替代方法,可以替代合成柔性热电材料的其他众所周知的策略。代替在柔性基板上印刷薄的有源层或掺杂导电聚合物,我们使用石墨,氧化铜(I)和聚三氟氯乙烯的混合物生产热电浆料。研究糊剂的塞贝克系数在10和600μV K-1之间变化,而电导率跨越10(-4)到10(2)S m(-1)甚至更大的范围。在此,揭示了诸如渗滤现象对电传输的影响。石墨聚合物浆料的功率因数达到5.69 x 10(-4)+/- 0.70 x 10(-4)μW m(-1)K-2,在石墨的摩尔分数约为1.0时出乎意料的最小值0.4。该值与粉末混合物的值相当,后者稍高,但可调精度较差。进一步评估此类化合物的实际应用。石墨聚合物糊剂用于举例说明逐步制造柔性热电传感器的方法。我们的结果代表了原理证明,即热电浆料是当前解决方案的可行替代方案。通过使用高性能热电材料和导电聚合物,可以进一步扩大复合材料的范围。

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