首页> 外文期刊>Langmuir: The ACS Journal of Surfaces and Colloids >Copper(II)-mediated layer-by-layer assembly of viologenthiol-functionalized carbon nanotube hybrid multilayers: Preparation, characterization, morphology, and electrochemical properties
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Copper(II)-mediated layer-by-layer assembly of viologenthiol-functionalized carbon nanotube hybrid multilayers: Preparation, characterization, morphology, and electrochemical properties

机译:紫铜硫醇官能化碳纳米管杂化多层膜的铜(II)介导的逐层组装:制备,表征,形态和电化学性能

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摘要

The metal-mediated self-assembly of coordination polymers, building blocks, and metal-organic frameworks has been widely used to construct multifunctional novel materials on the molecular level. Here, we developed this technique to build up multilayers of functionalized carbon nanotubes on the basis of both intermolecular electrostatic and coordinative interactions. Positively charged electroactive viologenthiol (VSH) was first immobilized on multiwalled carbon nanotubes (MWNTs) to form MWNT-VSH hybrids with a relative content of ~9% by weight. Field emission transmission electron microscopy images revealed that the VSH molecules randomly covered the surfaces of MWNTs with a thickness of 1 to 2 nm. Then, the MWNT-VSH hybrids were used as nanoscale multidentate "ligands" (linkers) to construct metal-mediated multilayers with the use of CuAc _2 as the connectors by the layer-by-layer (LBL) method. The assembly process was monitored by absorption and X-ray photoelectron spectroscopy as well as scanning electron and atomic force microscopy after each assembly of Cu(II) ions and MWNT-VSH hybrids. Finally, the electrochemical behaviors of the viologens in the MWNT-VS/Cu LBL multilayers were investigated.
机译:金属介导的配位聚合物,构件和金属有机骨架的自组装已广泛用于在分子水平上构建多功能新型材料。在这里,我们开发了这种技术,以基于分子间静电和配位相互作用建立功能化碳纳米管的多层结构。首先将带正电荷的电活性硫代硫醇(VSH)固定在多壁碳纳米管(MWNT)上,以形成相对含量约为9%的MWNT-VSH杂化物。场发射透射电子显微镜图像显示,VSH分子随机覆盖了MWNTs的表面,厚度为1-2 nm。然后,将MWNT-VSH杂化体用作纳米级多齿“配体”(连接体),通过逐层(LBL)方法使用CuAc _2作为连接体构建金属介导的多层。每次组装Cu(II)离子和MWNT-VSH杂化物后,通过吸收和X射线光电子能谱以及扫描电子和原子力显微镜对组装过程进行监控。最后,研究了紫罗兰酸酯在MWNT-VS / Cu LBL多层膜中的电化学行为。

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