Electrodeposition of separated 3D metallic structures by pulse-reverse plating in magnetic gradient fields

摘要

We present a new technique for electrodeposition of separated three-dimensional metallic structures solely by the superposition of magnetic gradient fields. Separate columns and stripes of Cu are generated by pulse reverse plating controlled by tailored magnetic field gradients. It is demonstrated that structures of μm-dimension are accessible with this technique and that the height of deposited structures can be adjusted by the number of plating cycles. The experimental observations are explained by the action of the magnetic field gradient force on the paramagnetic Cu~(2+)-ions during the deposition and the dissolution part of the cycle. Additional influences of the Lorentz force are also discussed.